F-Term-List

H05H1/00-1/54

AA00
APPLICATIONS

AA01

AA02

AA03

AA04

AA05

AA06

AA07

AA08

. Surface processing and surface treatment

. . Etching

. . Surface cleaning and ashing

. . Physical vapor phase deposition (PVD)

. . Chemical vapor phase deposition (CVD)

. . Thermal spraying

. . Surface quality improvement

. . Ion injection

AA11

AA12

AA13

AA14

AA15

AA16

AA17

AA18

AA19

AA20

. Light sources (visible, ultraviolet, X ray)

. Ion source and electron source

. Radical and neutral particle sources

. Gas sources (ozone, hydrogen, etc.)

. Heat sources

. . Welding, joining, cutting

. Waste and hazardous substance disposal

. . Gases (including dust collection)

. . Liquids

. . Solids

AA21

AA22

AA23

AA24

AA25

AA26

AA27

AA28

. Nuclear fusion, MHD power generation, etc.

. Power and propulsion sources

. Generating gas currents (ionized wind)

. Medical treatment

. Sterilization and disinfection

. Chemical reactions (synthesis, polymerization, etc., excluding CVD)

. Material analysis

. Ignition (internal combustion engines, etc.)

BB00
PURPOSES AND EFFECTS

BB01

BB02

BB03

BB04

BB05

BB06

BB07

. Optimization of plasma characteristics

. . Density (high or low density, etc.)

. . Temperature (high or low temperature, etc.)

. . Reactivity (high activation, etc.)

. . Distribution (density, temperature, reactivity, etc.)

. . Time of ignition, starting up, annihilating or shutting down

. . Abnormal discharge control

BB11

BB12

BB13

BB14

BB15

BB16

. Improvement in processing capacity and processing quality

. . High speed processing and high throughput

. . Handling large objects

. . Uniformizing processing of the same object

. . Uniformizing processing of multiple objects

. . Uniformizing processing of multiple devices

BB21

BB22

BB23

BB24

BB25

BB26

BB27

BB28

BB29

BB30

. Improvement in general characteristics of apparatus (excluding plasma characteristics)

. . Facilitation or automation of operation and improvement of operability

. . Longer life, improvement in durability and corrosion resistance

. . Improving safety

. . Serviceability improvement and maintenance

. . . Prevention of debris generation

. . . Prevention of contamination (depositing) within apparatuses

. . . Prevention of sputtering within apparatuses

. . . Cleaning of apparatuses using discharge

. . . Replacing, repairing and cleaning of parts

BB31

BB32

BB33

BB34

BB35

BB36

BB37

. . Improvement of strength and heat resistance and prevention of deformation

. . . Prevention of damages by heat expansion and thermal stress

. . Prevention of failures caused by electrical factors

. . Noise prevention (measures for electromagnetic interference, malfunction, etc.)

. . Reduction in size and weight

. . Energy saving and power saving

. . Facilitation, simplification and cost reduction of manufacture, and mass production

CC00
PLASMA GENERATION

CC01

CC02

CC03

CC04

CC05

CC06

CC07

CC08

CC09

. Generation by electric power

. . Direct currents

. . Alternating currents

. . High frequency microwaves (characterized by frequency )

. . . 30 - 300MHz (VHF bands)

. . . 300M - 3GHz (UHF bands)

. . Characterized by waveforms

. . . Pulse

. . Using multiple bands and frequencies (including modulation)

CC11

CC12

CC13

CC14

CC15

CC16

CC17

CC18

CC19

CC20

. . Generating methods

. . . Capacitive coupling (CCP)

. . . Inductive coupling (ICP)

. . . Microwave discharge

. . . . Electron cyclotron resonance (ECR)

. . . . Surface wave excitation (SWP)

. . . Effective magnetic field methods other than ECR

. . . Hollow cathode discharge

. . . Dielectric barrier discharge (silent discharge)

. . . Creeping discharge

CC21

CC22

CC23

CC24

CC25

CC27

. . . Glow discharge

. . . Corona discharge

. . . Arch discharge

. . . Streamer discharge

. . Preionization and seed plasma formation

. Generation by non-electrical power

CC31

CC32

CC33

CC34

CC35

. Generating media

. . Gas

. . . Vacuum and low pressure

. . . Atmospheric pressure and normal pressure

. . Liquid

DD00
DEVICE CONFIGURATION (1) POWER INTAKE UNITS

DD01

DD02

DD03

DD04

DD05

. Types of applying elements

. . Electrodes (for CCP)

. . Coils (for ICP)

. . Antennas (that radiate electromagnetic waves)

. . Hybrid types (multiple kinds)

DD11

DD12

DD13

DD14

DD15

DD16

DD17

DD18

DD19

DD20

. Shapes and structures of applying elements

. . Bar, needle, or line type (including monopole, etc.)

. . . Ring, whirlpool or spiral type

. . Plane type

. . . Parallel flat plate type

. . . Strip type

. . Tube type

. . . Coaxial tube type

. . With slots (for electromagnetic emission)

. . . Waveguide type

DD21

DD22

DD23

DD24

DD25

. . Characterized by surface forms (unevenness, etc.)

. . Having coating on surface

. . With media flow path (showerhead, nozzle, etc.)

. . Also used as supports for treated materials

. . Multiple applying elements (same kind)

DD31

DD32

DD33

DD34

DD35

DD37

DD38

DD39

DD40

. Connection of multiple applying elements (including hybrids)

. . Parallel connection

. . Serial connection

. . Adjustments between elements

. . Independent power source for each element

. Auxiliary electrodes

. . Biasing electrodes

. . Extracting electrodes

. . Electromagnetic shielding and electrostatic shielding electrodes

DD41

DD42

DD43

DD44

DD45

DD46

DD47

DD48

DD49

. Transmission lines

. . Coaxial lines (including coaxial waveguides)

. . Strip lines

. . Waveguides

. . . Rectangular

. . . Circular

. . . With mode converters

. . Branching and distributing

. . . Transformer type

DD51

DD53

DD55

DD56

DD57

. Circulators and isolators

. Directional couplers

. Impedance matching devices

. . Stubs and tuners

. . Characterized by matching circuits

DD61

DD62

DD63

DD64

DD65

DD66

DD67

DD68

. Phase adjustments

. Characterized by introduction windows (dielectric windows)

. Characterized by materials

. Characterized by manufacturing methods

. Characterized by power feed positions

. Characterized by placement locations

. Characterized by moving and rotating

. Limited values (included in claims)

EE00
DEVICE CONFIGURATION (1) POWER SUPPLY UNITS

EE01

EE02

EE03

EE04

EE05

EE06

EE07

EE09

EE10

. Oscillators

. . Variable frequency

. . PLL circuits

. Attenuators

. Pulse generators

. Amplifiers

. . Variable gain

. Magnetrons (oscillation, amplification)

. Resonant circuits

EE11

EE12

EE13

EE14

EE15

EE16

EE17

EE18

. Rectifiers (converting from AC to DC)

. Inverters (converting from DC to AC)

. Frequency conversion

. Voltage conversion of DC power

. Boosters and transformers

. Characterized by waveforms

. . Relating to pulse width and pause width (duty)

. . Relating to rising or rising properties

EE21

EE22

EE23

EE24

EE25

EE26

EE28

. Characterized by circuit configuration

. . Voltage control

. . Current control

. . Switching elements and rectifying elements

. . Impedance elements (L, C and R)

. . . Variable

. Characterized by locations of grounding

FF00
DEVICE CONFIGURATION (3) CONTAINERS, COOLING, HEATING, ETC.

FF01

FF02

FF03

FF04

FF06

FF07

FF08

. Characterized by containers

. . Remote type, down flow type, etc.

. . Having opening/closing mechanisms

. . Characterized by plasma facing surfaces

. Characterized by susceptors and placement stages

. . Moving and rotating mechanisms

. . Treating multiple surfaces or objects

FF11

FF12

FF13

FF14

FF15

FF16

FF18

FF19

FF20

. Characterized by media introducing sections

. . Mixers and vaporizers

. . Characterized by introduction adjustment sections (flow rate, pressure, mix, etc.)

. . Inlets

. . . Having medium diffusion sections

. . . Gas curtains and shielding gases

. Characterized by medium outlet sections

. . Collection and disposal of exhausted media

. . Characterized by exhaust adjustment sections

FF21

FF22

FF23

FF25

FF26

FF27

FF28

FF29

. Anti-noise measures such as electromagnetic shielding or electrostatic shielding

. Characterized by connecting sections (airtight, sealing, insulating, etc.)

. Characterized by grounding

. Characterized by means for generating magnetic field

. . For plasma generation

. . For plasma containment

. . Permanent magnets

. . Electromagnets (including superconductive)

FF31

FF32

FF33

FF34

FF35

FF36

FF38

FF39

FF40

. Characterized by cooling and heating means

. . Applying elements

. . Containers

. . Windows

. . Power source and transmission systems

. Heat insulation and heat shielding

. Characterized by materials

. Characterized by shapes and structures

. Characterized by placement

GG00
DEVICE CONFIGURATION (4) TORCHES

GG01

GG02

GG03

GG04

GG06

GG07

GG08

GG09

. Shapes of plasma generating units

. . Tubular

. . . Multiple tubes

. . Square or slit type

. Transferring type

. Non-transferring type

. Electrodeless type

. Multi-stage type

GG11

GG12

GG13

GG14

GG15

GG16

GG18

. Characterized by electrodes

. . Characterized by shapes, etc., of cathodes

. . Characterized by materials of cathodes

. . Characterized by shapes, etc., of anodes

. . Characterized by materials of anodes

. Characterized by coils and microwave introduction units

. Characterized by nozzles

GG21

GG22

GG23

GG24

GG25

GG26

GG28

GG29

GG30

. Characterized by gas introduction systems

. . Plasma gas

. . Process gas

. . Protective gas

. . . Prevention of air inclusion

. . Eddies and swirling flows

. Characterized by assembling (including centering)

. Characterized by systems for introducing materials and samples

. Multiple torches

HH00
MEASUREMENT, DIAGNOSIS & CONTROL

HH01

HH02

HH03

HH04

HH05

HH06

HH07

HH08

HH09

HH10

. Objects of measurement, diagnosis and control

. . Plasma characteristics

. . Non-plasma characteristics

. . . Excitation source

. . . . Power source, microwave source

. . . . . Auxiliary power source (bias source, magnetic excitation source, etc.)

. . . Transmission system (electrode, distributor, introduction window, etc.)

. . . Matching system

. . . Medium intake and discharge units

. . . Treated object intake and discharge units

HH11

HH12

HH14

HH15

HH16

HH17

HH18

HH19

HH20

. . . Containers and placement stages

. . . Magnets, cooling and heating, etc.

. Subject factors of measurement, diagnosis and control

. . Ions

. . Electrons

. . Radicals, neutral particles and clusters

. . Kinds and compositions (including impurities)

. . Density

. . Temperature and energy

HH21

HH22

HH23

HH24

HH25

HH26

HH27

HH28

HH29

HH30

. . Current and current density

. . Potential and potential difference (electric field, voltage)

. . Impedance and electric resistance

. . Inductance and capacitance

. . Frequency, resonant frequency and wave length

. . Pulse and waveform ( width, number, duty ratio, etc.)

. . Phase and phase difference

. . Output and power

. . Injection rate, reflection coefficient, standing wave ratio and mode

. . Distribution, image, location and shape (including sheath thickness)

HH31

HH32

HH33

HH34

HH35

HH36

HH37

. . Dynamics, stability, fluctuation and aging

. . Plasma generation and plasma decay

. . Abnormal discharge

. . Electromagnetic wave and visible ray

. . Pressure and degree of vacuum

. . Flow quantity and exhaust velocity

. . Deformation, corrosion, consumption and failure

HH41

HH42

HH43

HH44

HH45

HH46

HH47

. Measuring means and method

. . Optical and microwave measurement (including electromagnetic wave, etc.)

. . Electric and magnetic measurement

. . Probe

. . Heat measurement, temperature measurement, pressure and humidity

. . Acoustic measurement (including ultrasonic wave )

. . Characterized by placement location

HH51

HH52

HH53

HH54

HH55

HH56

HH57

. Control means and methods

. . Feedback control

. . Control by other than feed back

. . Characterized by control software or flowcharts

. . Control and operation conditions (numerical limitation, table reference, etc.)

. . Timing, duration and sequence of control and operation

. . Control for abnormal occurrence, power outage, disaster, etc.

2G084	PLASMA TECHNOLOGY
	H05H1/00 -1/54