FI (list display)

  • H10N15/00
  • Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect (integrated devices or assemblies of multiple devices H10N 19/00) [2023.01] HB CC 5F091
  • H10N15/10
  • .Thermoelectric devices using thermal change of the dielectric constant, e.g. working above and below the Curie point [2023.01] HB CC 5F091
  • H10N15/20
  • .Thermomagnetic devices using thermal change of the magnetic permeability, e.g. working above and below the Curie point [2023.01] HB CC 5F091
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