Japanese
close

FI (list display)

  • H10N10/00
    		•  Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects (integrated devices or assemblies of multiple devices H10N 19/00) [2023.01]
    		HB CC 5F091
  • H10N10/00@S
    		•  Temperature-sensitive semiconductor elements or switches HB CC 5F091
  • H10N10/00@Z
    		•  Others HB CC 5F091
  • H10N10/01
    		•  .Manufacture or treatment [2023.01] HB CC 5F091
  • H10N10/10
    		•  .operating with only the Peltier or Seebeck effects [2023.01] HB CC 5F091
  • H10N10/10@C
    		•  Peltier devices or Seebeck devices characterized by their circuits HB CC 5F091
  • H10N10/10@Z
    		•  Others HB CC 5F091
  • H10N10/13
    		•  ..characterised by the heat-exchanging means at the junction [2023.01] HB CC 5F091
  • H10N10/17
    		•  ..characterised by the structure or configuration of the cell or thermocouple forming the device [2023.01] HB CC 5F091
  • H10N10/17@A
    		•  Structures or arrangements of thermocouples, e.g., thermopiles HB CC 5F091
  • H10N10/17@Z
    		•  Others, e.g., thermomodules or for power generation HB CC 5F091
  • H10N10/80
    		•  .Constructional details [2023.01] HB CC 5F091
  • H10N10/81
    		•  ..Structural details of the junction [2023.01] HB CC 5F091
  • H10N10/813
    		•  ...the junction being separable, e.g. using a spring [2023.01] HB CC 5F091
  • H10N10/817
    		•  ...the junction being non- separable, e.g. being cemented, sintered or soldered [2023.01] HB CC 5F091
  • H10N10/82
    		•  ..Connection of interconnections [2023.01] HB CC 5F091
  • H10N10/85
    		•  ..Thermoelectric active materials [2023.01] HB CC 5F091
  • H10N10/851
    		•  ...comprising inorganic compositions [2023.01] HB CC 5F091
  • H10N10/852
    		•  ....comprising tellurium, selenium or sulfur [2023.01] HB CC 5F091
  • H10N10/853
    		•  ....comprising arsenic, antimony or bismuth (H10N 10/852 takes precedence) [2023.01] HB CC 5F091
  • H10N10/854
    		•  ....comprising only metals (H10N 10/852, H10N 10/853 take precedence) [2023.01] HB CC 5F091
  • H10N10/855
    		•  ....comprising compounds containing boron, carbon, oxygen or nitrogen [2023.01] HB CC 5F091
  • H10N10/856
    		•  ...comprising organic compositions [2023.01] HB CC 5F091
  • H10N10/857
    		•  ...comprising compositions changing continuously or discontinuously inside the material [2023.01] HB CC 5F091
    TOP