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This page displays all 「FI」 in main group H10K71/00. |
HB:Handbook | ||||
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CC:Concordance | |||||
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Manufacture or treatment specially adapted for the organic devices covered by this subclass [2023.01] | HB | CC | 3K107 | |
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.aging | HB | CC | 3K107 | |
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.substrate separation | HB | CC | 3K107 | |
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.repair | HB | CC | 3K107 | |
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.Deposition of organic active material [2023.01] | HB | CC | 3K107 | |
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.. using liquid deposition, e.g. spin coating [2023.01] | HB | CC | 3K107 | |
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... using printing techniques, e.g. ink-jet printing or screen printing [2023.01] | HB | CC | 3K107 | |
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... characterised by the solvent used [2023.01] | HB | CC | 3K107 | |
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.. using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering [2023.01] | HB | CC | 3K107 | |
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...by means of vacuum deposition | HB | CC | 3K107 | |
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...selective deposition, e.g., use of masks | HB | CC | 3K107 | |
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.. using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet [2023.01] | HB | CC | 3K107 | |
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.Changing the shape of the active layer in the devices, e.g. patterning [2023.01] | HB | CC | 3K107 | |
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.Doping active layers, e.g. electron transporting layers [2023.01] | HB | CC | 3K107 | |
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.Thermal treatment, e.g. annealing in the presence of a solvent vapour [2023.01] | HB | CC | 3K107 | |
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.Forming devices by joining two substrates together, e.g. lamination techniques [2023.01] | HB | CC | 3K107 | |
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.Forming conductive regions or layers, e.g. electrodes [2023.01] | HB | CC | 3K107 | |
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.Testing, e.g. accelerated lifetime tests [2023.01] | HB | CC | 3K107 | |
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. using temporary substrates [2023.01] | HB | CC | 3K107 | |