FI (list display)

  • H10K50/00
  • Organic light-emitting devices (integrated devices or assemblies of multiple devices H10K 59/00, H10K 65/00; organic semiconductor lasers H01S 5/36) [2023.01] HB CC 3K107
  • H10K50/10
  • .OLEDs or polymer light-emitting diodes [PLED] [2023.01] HB CC 3K107
  • H10K50/10,321
  • ..inverted OLED, e.g., with the cathodes provided between the anodes and the substrates HB CC 3K107
  • H10K50/11
  • ..characterised by the electroluminescent [EL] layers [2023.01] HB CC 3K107
  • H10K50/115
  • ... comprising active inorganic nanostructures, e.g. luminescent quantum dots [2023.01] HB CC 3K107
  • H10K50/12
  • ... comprising dopants [2023.01] HB CC 3K107
  • H10K50/125
  • ... specially adapted for multicolour light emission, e.g. for emitting white light [2023.01] HB CC 3K107
  • H10K50/13
  • .... comprising stacked EL layers within one EL unit [2023.01] HB CC 3K107
  • H10K50/135
  • ... comprising mobile ions [2023.01] HB CC 3K107
  • H10K50/14
  • ..Carrier transporting layers [2023.01] HB CC 3K107
  • H10K50/15
  • ... Hole transporting layers [2023.01] HB CC 3K107
  • H10K50/155
  • .... comprising dopants [2023.01] HB CC 3K107
  • H10K50/16
  • ... Electron transporting layers [2023.01] HB CC 3K107
  • H10K50/165
  • .... comprising dopants [2023.01] HB CC 3K107
  • H10K50/17
  • ..Carrier injection layers [2023.01] HB CC 3K107
  • H10K50/17,171
  • ...Electron injection layer HB CC 3K107
  • H10K50/18
  • ..Carrier blocking layers [2023.01] HB CC 3K107
  • H10K50/19
  • ..Tandem OLEDs [2023.01] HB CC 3K107
  • H10K50/30
  • .Organic light-emitting transistors [2023.01] HB CC 3K107
  • H10K50/80
  • .Constructional details [2023.01] HB CC 3K107
  • H10K50/805
  • .. Electrodes [2023.01] HB CC 3K107
  • H10K50/81
  • ... Anodes [2023.01] HB CC 3K107
  • H10K50/813
  • .... characterised by their shape [2023.01] HB CC 3K107
  • H10K50/814
  • .... combined with auxiliary electrodes, e.g. ITO layer combined with metal lines [2023.01] HB CC 3K107
  • H10K50/816
  • .... Multilayers, e.g. transparent multilayers [2023.01] HB CC 3K107
  • H10K50/818
  • .... Reflective anodes, e.g. ITO combined with thick metallic layers [2023.01] HB CC 3K107
  • H10K50/82
  • ... Cathodes [2023.01] HB CC 3K107
  • H10K50/822
  • .... characterised by their shape [2023.01] HB CC 3K107
  • H10K50/824
  • .... combined with auxiliary electrodes [2023.01] HB CC 3K107
  • H10K50/826
  • .... Multilayers, e.g. opaque multilayers [2023.01] HB CC 3K107
  • H10K50/828
  • .... Transparent cathodes, e.g. comprising thin metal layers [2023.01] HB CC 3K107
  • H10K50/84
  • ..Passivation; Containers; Encapsulations [2023.01] HB CC 3K107
  • H10K50/84,846
  • ...Including getter materials or desiccants HB CC 3K107
  • H10K50/842
  • ... Containers [2023.01] HB CC 3K107
  • H10K50/842,141
  • ....Self-supporting sealing members, e.g., encapsulated substrates, encapsulated bases HB CC 3K107
  • H10K50/842,423
  • ....metal sealing members HB CC 3K107
  • H10K50/842,426
  • ....peripheral seal members, e.g., adhesives, sealing agents HB CC 3K107
  • H10K50/842,428
  • ....Vertical spacers, e.g., arranged between sealing members and OLEDs. HB CC 3K107
  • H10K50/844
  • ... Encapsulations [2023.01] HB CC 3K107
  • H10K50/844,445
  • ....Multilayered coatings with repetitive structures, e.g., multilayered structures with multiple organic-inorganic layers HB CC 3K107
  • H10K50/85
  • ..Arrangements for extracting light from the devices [2023.01] HB CC 3K107
  • H10K50/852
  • ... comprising a resonant cavity structure, e.g. Bragg reflector pair [2023.01] HB CC 3K107
  • H10K50/854
  • ... comprising scattering means [2023.01] HB CC 3K107
  • H10K50/856
  • ... comprising reflective means [2023.01] HB CC 3K107
  • H10K50/858
  • ... comprising refractive means, e.g. lenses [2023.01] HB CC 3K107
  • H10K50/86
  • ..Arrangements for improving contrast, e.g. preventing reflection of ambient light [2023.01] HB CC 3K107
  • H10K50/86,865
  • ...having light absorbing layers, e.g., light-shielding layers HB CC 3K107
  • H10K50/87
  • ..Arrangements for heating or cooling [2023.01] HB CC 3K107
  • H10K50/88
  • ..Terminals, e.g. bond pads [2023.01] HB CC 3K107
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