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This page displays all 「FI」 in main group H05K1/00. |
HB:Handbook | ||||
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CC:Concordance | |||||
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Printed circuits[2006.01] | HB | CC | 5E338 | |
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.Details[2006.01] | HB | CC | 5E338 | |
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characterized by the shape or structure of the board | HB | CC | 5E338 | |
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.deformed as a plate member | HB | CC | 5E338 | |
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.related to the shape or layout of the hole | HB | CC | 5E338 | |
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.related to board reinforcement (simple reinforcement; each having a conductive layer 1/14) | HB | CC | 5E338 | |
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..Reinforcement by a metal foil (dummy pattern for preventing board camber) | HB | CC | 5E338 | |
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.Area-deteriorated (this category is assigned to the heat radiation plate) (this category is assigned to cooling by other than wiring.) | HB | CC | 5E338 | |
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.Board having a cutting means (reinforcement provided on the cut-off position G) | HB | CC | 5E338 | |
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..Board to be cut that has a jumper wire | HB | CC | 5E338 | |
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characterized by the wiring pattern (not functioning as an electrical part) | HB | CC | 5E338 | |
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.related to protective wiring (relative protection of wiring D) | HB | CC | 5E338 | |
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.Wiring conductor deformed in three-dimensional manner (including deformation along with the board) | HB | CC | 5E338 | |
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.related to the universal wiring board | HB | CC | 5E338 | |
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.related to the power supply or earth wiring (takes precedence over P.) | HB | CC | 5E338 | |
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.related to the shield wiring (including impedance matching) | HB | CC | 5E338 | |
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.related to the heat radiation wiring (heat radiation by other than wiring F) | HB | CC | 5E338 | |
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Board having ID indication (Also refer to H 05 K 1/18.) | HB | CC | 5E338 | |
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.Identification by colour | HB | CC | 5E338 | |
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Board having an optical conduction means | HB | CC | 5E338 | |
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Others | HB | CC | 5E338 | |
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..Use of materials for the substrate [3] | HB | CC | 5E341 | |
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...Substantially one layer as the board member | HB | CC | 5E341 | |
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Board member consisting of one layer (lamination of the same material is treated as one layer even though the structure consists of multi-layer lamination.) | HB | CC | 5E341 | |
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Inorganic component as the main component, e.g. alumina, glass, mica, ceramic paper | HB | CC | 5E341 | |
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.characterized by composition of components | HB | CC | 5E341 | |
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..consisting of ceramics | HB | CC | 5E341 | |
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...consisting of aluminium nitride or AIN | HB | CC | 5E341 | |
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Organic component as the main component | HB | CC | 5E341 | |
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.characterized by the resin component | HB | CC | 5E341 | |
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..Polyolefin, acryl | HB | CC | 5E341 | |
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..Phenol | HB | CC | 5E341 | |
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..Epoxy | HB | CC | 5E341 | |
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..Polyester (saturated or unsaturated) | HB | CC | 5E341 | |
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..Polyimide, polyamide | HB | CC | 5E341 | |
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...Polyimide precursor, polyamic acid, polyamide acid | HB | CC | 5E341 | |
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.characterized by the additive (added to the organic component as the base | HB | CC | 5E341 | |
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..Additive for an inorganic compound | HB | CC | 5E341 | |
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..Additive for an organic compound | HB | CC | 5E341 | |
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.characterized by the pre-preg base (glass cloth, fabric, non-woven fabric, paper) | HB | CC | 5E341 | |
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..Aramid, all aromatic amides | HB | CC | 5E341 | |
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Others | HB | CC | 5E341 | |
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...Lamination | HB | CC | 5E341 | |
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Base consisting of a lamination structure | HB | CC | 5E341 | |
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.Lamination consisting of an organic component | HB | CC | 5E341 | |
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..One layer only specified (resin component configuring the layer) | HB | CC | 5E341 | |
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..Two layers specified | HB | CC | 5E341 | |
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..consisting of at least three layers | HB | CC | 5E341 | |
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..consisting of multiple types of pre-pregs only (including the composite type) | HB | CC | 5E341 | |
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.Lamination including an inorganic later | HB | CC | 5E341 | |
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..Copper-plated lamination including the metal foil or copper foil | HB | CC | 5E341 | |
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..including ceramics | HB | CC | 5E341 | |
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Others | HB | CC | 5E341 | |
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...Bonding via an adhesive layer | HB | CC | 5E341 | |
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...Flexible base | HB | CC | 5E341 | |
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having no adhesive layer | HB | CC | 5E341 | |
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Others | HB | CC | 5E341 | |
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...Insulated metal substrate [3] | HB | CC | 5E315 | |
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characterized by the insulation material (structure and material) | HB | CC | 5E315 | |
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characterized by the metal material (structure and material) | HB | CC | 5E315 | |
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related to the porcelain enamel board (takes precedence over A and B.) | HB | CC | 5E315 | |
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Others (earth connection of the metal core and circuit conductor) | HB | CC | 5E315 | |
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..Use of materials for the metallic pattern [3] | HB | CC | 4E351 | |
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characterized by the conductive material | HB | CC | 4E351 | |
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.including molybdenum and tungsten | HB | CC | 4E351 | |
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.using the conductive material for multiple layers (Refer to H 05 K 3/24, 3/22.) | HB | CC | 4E351 | |
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characterized by the organic material (inorganic material (B2O3, Al2O3) Z. This category is applied to organic vehicles.) | HB | CC | 4E351 | |
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Others (glass frit, etc.) | HB | CC | 4E351 | |
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..Printed elements for providing electric connections to or between printed circuits [3] | HB | CC | 5E317 | |
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related to the connection between wires on a board | HB | CC | 5E317 | |
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.Connection by printing | HB | CC | 5E317 | |
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related to the board connection | HB | CC | 5E317 | |
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.related to the wiring pattern (characterized by the connection pattern) | HB | CC | 5E317 | |
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.Protection means applied | HB | CC | 5E317 | |
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related to the side connection of the front and rear conductor | HB | CC | 5E317 | |
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.using a connection device | HB | CC | 5E317 | |
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Through-hole connection of the front and rear conductor (connection by the conductive layer on the inner surface of the through-hole) | HB | CC | 5E317 | |
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.using a lead wire (connection between the front and rear sides by inserting a lead wire into the through-hole) | HB | CC | 5E317 | |
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.Using deformation of the conductor (deformation of the conductor that continues from the wiring layer) | HB | CC | 5E317 | |
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.using a solid conductor (pin, etc.) | HB | CC | 5E317 | |
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.using a hollow conductor (eyelet, etc.) | HB | CC | 5E317 | |
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.filling a conductive material | HB | CC | 5E317 | |
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Others (blind hole, inspection terminal) | HB | CC | 5E317 | |
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..Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K 1/11, H01R 12/00) | HB | CC | 5E344 | |
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Direct connection of printed circuit boards | HB | CC | 5E344 | |
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.Fitting one printed circuit board into another | HB | CC | 5E344 | |
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.Connection between the printed circuit board and flexible board | HB | CC | 5E344 | |
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.Vertical connection of printed circuit boards | HB | CC | 5E344 | |
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Connection of printed circuit boards via a connection member | HB | CC | 5E344 | |
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.Electronic part used as the connection member | HB | CC | 5E344 | |
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.Connection by overlapping printed circuit boards together | HB | CC | 5E344 | |
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.characterized by the connection member | HB | CC | 5E344 | |
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..Organic conductive material as the connection member (Refer to H 05 K 3/32.) | HB | CC | 5E344 | |
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Others | HB | CC | 5E344 | |
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.incorporating printed electric components, e.g. printed resistors, capacitors or inductors[2006.01] | HB | CC | 4E351 | |
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consisting of printed electrical parts only | HB | CC | 4E351 | |
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.Single printed part (mainly printed coil. Main category is H 01 F 17 or 15.) | HB | CC | 4E351 | |
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..Printed resistor | HB | CC | 4E351 | |
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..Printed capacitor | HB | CC | 4E351 | |
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Combination of the printed electrical part and non-printed electrical part | HB | CC | 4E351 | |
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Others | HB | CC | 4E351 | |
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.structurally associated with non-printed electric components (H05K0001160000 takes precedence)[2026.01] | HB | CC | 5E336 | |
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Direct installation of multiple parts on the printed board | HB | CC | 5E336 | |
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.using an accessory ( , via a connector U) | HB | CC | 5E336 | |
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Indirect installation of the electrical part on the printed board (connector itself H 01 R) | HB | CC | 5E336 | |
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Others | HB | CC | 5E336 | |
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(Not Translated) | HB | CC | 5E336 | |
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(Not Translated) | HB | CC | 5E336 | |
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(Not Translated) | HB | CC | 5E336 | |
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(Not Translated) | HB | CC | 5E336 | |
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(Not Translated) | HB | CC | 5E336 | |
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(Not Translated) | HB | CC | 5E336 | |
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(Not Translated) | HB | CC | 5E336 | |
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(Not Translated) | HB | CC | 5E336 | |
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(Not Translated) | HB | CC | 5E336 | |
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(Not Translated) | HB | CC | 5E336 | |
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(Not Translated) | HB | CC | 5E336 | |
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(Not Translated) | HB | CC | 5E336 | |
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(Not Translated) | HB | CC | 5E336 | |
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(Not Translated) | HB | CC | 5E336 | |
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(Not Translated) | HB | CC | 5E336 | |
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(Not Translated) | HB | CC | 5E336 | |
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(Not Translated) | HB | CC | 5E336 | |
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(Not Translated) | HB | CC | 5E336 | |
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(Not Translated) | HB | CC | 5E336 | |
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(Not Translated) | HB | CC | 5E336 | |
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(Not Translated) | HB | CC | 5E336 | |
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(Not Translated) | HB | CC | 5E336 | |