This page displays all 「FI」 in main group H01H37/00. |
HB:Handbook | ||||
CC:Concordance |
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Thermally-actuated switches | HB | CC | 5G041 | |
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Testing methods | HB | CC | 5G041 | |
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Non-contact switches | HB | CC | 5G041 | |
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Others | HB | CC | 5G041 | |
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.Details | HB | CC | 5G041 | |
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Manual operation mechanisms | HB | CC | 5G041 | |
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Lead wires (connection) | HB | CC | 5G041 | |
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Others | HB | CC | 5G041 | |
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..Bases; Housings; Mountings | HB | CC | 5G041 | |
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Boxes or mounting | HB | CC | 5G041 | |
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Sealing | HB | CC | 5G041 | |
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Others | HB | CC | 5G041 | |
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...to facilitate replacement, e.g. cartridge housing | HB | CC | 5G041 | |
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..Indicators; Distinguishing marks | HB | CC | 5G041 | |
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..Compensation for variation of ambient temperature or pressure | HB | CC | 5G041 | |
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..Means for adjustment of "on" or "off" operating temperature | HB | CC | 5G041 | |
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...by anticipatory electric heater | HB | CC | 5G041 | |
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...by varying the proportion of input heat received by the thermal element, e.g. by displacement of a shield | HB | CC | 5G041 | |
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...by varying bias on the thermal element due to a separate spring | HB | CC | 5G041 | |
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...by varying the position of the thermal element in relation to switch base or casing | HB | CC | 5G041 | |
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...by adjustment of a member transmitting motion from the thermal element to contacts or latch | HB | CC | 5G041 | |
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...by adjustment of position of the movable contact on its driving member | HB | CC | 5G041 | |
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...by adjustment of abutment for "off" position of the movable contact | HB | CC | 5G041 | |
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...by adjustment of the position of the fixed contact | HB | CC | 5G041 | |
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...by varying the position of the contact unit in relation to switch base or casing | HB | CC | 5G041 | |
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..Thermally-sensitive members | HB | CC | 5G041 | |
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Temperature detecting resistors | HB | CC | 5G041 | |
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Thermocouples | HB | CC | 5G041 | |
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Shape memory metals | HB | CC | 5G041 | |
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Combinations of bimetal and different temperature detecting elements | HB | CC | 5G041 | |
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Others (superconductive elements) | HB | CC | 5G041 | |
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...Means for transmitting heat thereto, e.g. capsule remote from contact member | HB | CC | 5G041 | |
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...actuated due to expansion or contraction of a fluid with or without vaporisation (the fluid forming a contact of the switch H01H 29/04, H01H 29/30) | HB | CC | 5G041 | |
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....with bellows | HB | CC | 5G041 | |
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....with diaphragm | HB | CC | 5G041 | |
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....with curled flexible tube, e.g. Bourdon tube | HB | CC | 5G041 | |
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....with piston and cylinder | HB | CC | 5G041 | |
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...actuated due to expansion or contraction of a solid (deflection of a bimetallic element H01H 37/52) | HB | CC | 5G041 | |
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....with extensible rigid rods or tubes | HB | CC | 5G041 | |
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Lateral direction | HB | CC | 5G041 | |
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Axial direction | HB | CC | 5G041 | |
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Tensile rotation | HB | CC | 5G041 | |
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Combinations of multiple directions | HB | CC | 5G041 | |
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Others | HB | CC | 5G041 | |
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....with extensible wires under tension | HB | CC | 5G041 | |
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...actuated due to deflection of bimetallic element | HB | CC | 5G041 | |
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Contacts directly mounted on diaphragms | HB | CC | 5G041 | |
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Bimetals pushing contact members | HB | CC | 5G041 | |
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.With quick-motion mechanisms | HB | CC | 5G041 | |
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..With quick-motion mechanisms of micro switch types | HB | CC | 5G041 | |
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Bimetals as a piece part for switches | HB | CC | 5G041 | |
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Using special bimetals e.g. spiral | HB | CC | 5G041 | |
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Methods for manufacturing bimetals | HB | CC | 5G041 | |
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Others | HB | CC | 5G041 | |
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....wherein the bimetallic element is inherently snap acting | HB | CC | 5G041 | |
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By disk shaped bimetals | HB | CC | 5G041 | |
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.Contacts directly mounted on disk diaphragms | HB | CC | 5G041 | |
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By snap action bimetals | HB | CC | 5G041 | |
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.Contacts directly mounted on snap action bimetals | HB | CC | 5G041 | |
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Others | HB | CC | 5G041 | |
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....having spirally wound or helically wound bimetallic element | HB | CC | 5G041 | |
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Swirl types | HB | CC | 5G041 | |
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Spiral types | HB | CC | 5G041 | |
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Others | HB | CC | 5G041 | |
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...actuated due to thermally controlled change of magnetic permeability | HB | CC | 5G018 | |
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Reed switch types | HB | CC | 5G018 | |
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.With means for mounting or securing | HB | CC | 5G018 | |
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Flying switch types | HB | CC | 5G018 | |
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Magnetism and electricity conversion types | HB | CC | 5G018 | |
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Suction retaining type | HB | CC | 5G018 | |
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.With repulsion forces by magnets | HB | CC | 5G018 | |
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.With repulsion forces by bimetals or shape memory metals | HB | CC | 5G018 | |
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.With repulsion forces by leaf springs | HB | CC | 5G018 | |
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.With repulsion forces by coil springs | HB | CC | 5G018 | |
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..Linear motions by repulsion forces | HB | CC | 5G018 | |
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Others | HB | CC | 5G018 | |
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..Means for producing snap action (inherent in bimetallic element H01H 37/54; caused by a magnet H01H 37/66) | HB | CC | 5G018 | |
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..Means other than thermal means for introducing a predetermined time delay | HB | CC | 5G018 | |
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..Contacts | HB | CC | 5G018 | |
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Multiple contacts | HB | CC | 5G018 | |
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Wiping contacts | HB | CC | 5G018 | |
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Auxiliary contacts | HB | CC | 5G018 | |
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Others | HB | CC | 5G018 | |
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...Magnetic reinforcement of contact pressure; Magnet causing snap action | HB | CC | 5G018 | |
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...sealed in evacuated or gas-filled tube | HB | CC | 5G018 | |
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...Resetting means | HB | CC | 5G018 | |
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.Switches in which the opening movement and the closing movement of a contact are effected respectively by heating and cooling or vice versa | HB | CC | 5G018 | |
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.Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling | HB | CC | 5G018 | |
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Using bimetals | HB | CC | 5G018 | |
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Using expansion or contraction of heat sensing materials | HB | CC | 5G018 | |
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Others | HB | CC | 5G018 | |
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..Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material | HB | CC | 5G502 | |
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Characterised by operating principles | HB | CC | 5G502 | |
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.Current not drawing through temperature sensing materials | HB | CC | 5G502 | |
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..Using helical springs | HB | CC | 5G502 | |
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..Using leaf springs | HB | CC | 5G502 | |
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.Current drawing through temperature sensing materials | HB | CC | 5G502 | |
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..Fusing temperature sensing materials | HB | CC | 5G502 | |
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..Anchored by temperature sensing materials | HB | CC | 5G502 | |
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..Flowing contacts | HB | CC | 5G502 | |
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..Resin contacts | HB | CC | 5G502 | |
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Characterised by mounting or assembling | HB | CC | 5G502 | |
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Characterised by manufacturing methods | HB | CC | 5G502 | |
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Board type thermal fuses | HB | CC | 5G502 | |
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.Chip type thermal fuses | HB | CC | 5G502 | |
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.Inserting type thermal fuses | HB | CC | 5G502 | |
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Others | HB | CC | 5G502 | |