FI (list display)

  • H01H37/00
  • Thermally-actuated switches HB CC 5G041
  • H01H37/00@A
  • Testing methods HB CC 5G041
  • H01H37/00@B
  • Non-contact switches HB CC 5G041
  • H01H37/00@Z
  • Others HB CC 5G041
  • H01H37/02
  • .Details HB CC 5G041
  • H01H37/02@A
  • Manual operation mechanisms HB CC 5G041
  • H01H37/02@B
  • Lead wires (connection) HB CC 5G041
  • H01H37/02@Z
  • Others HB CC 5G041
  • H01H37/04
  • ..Bases; Housings; Mountings HB CC 5G041
  • H01H37/04@A
  • Boxes or mounting HB CC 5G041
  • H01H37/04@B
  • Sealing HB CC 5G041
  • H01H37/04@Z
  • Others HB CC 5G041
  • H01H37/06
  • ...to facilitate replacement, e.g. cartridge housing HB CC 5G041
  • H01H37/08
  • ..Indicators; Distinguishing marks HB CC 5G041
  • H01H37/10
  • ..Compensation for variation of ambient temperature or pressure HB CC 5G041
  • H01H37/12
  • ..Means for adjustment of "on" or "off" operating temperature HB CC 5G041
  • H01H37/14
  • ...by anticipatory electric heater HB CC 5G041
  • H01H37/16
  • ...by varying the proportion of input heat received by the thermal element, e.g. by displacement of a shield HB CC 5G041
  • H01H37/18
  • ...by varying bias on the thermal element due to a separate spring HB CC 5G041
  • H01H37/20
  • ...by varying the position of the thermal element in relation to switch base or casing HB CC 5G041
  • H01H37/22
  • ...by adjustment of a member transmitting motion from the thermal element to contacts or latch HB CC 5G041
  • H01H37/24
  • ...by adjustment of position of the movable contact on its driving member HB CC 5G041
  • H01H37/26
  • ...by adjustment of abutment for "off" position of the movable contact HB CC 5G041
  • H01H37/28
  • ...by adjustment of the position of the fixed contact HB CC 5G041
  • H01H37/30
  • ...by varying the position of the contact unit in relation to switch base or casing HB CC 5G041
  • H01H37/32
  • ..Thermally-sensitive members HB CC 5G041
  • H01H37/32@A
  • Temperature detecting resistors HB CC 5G041
  • H01H37/32@B
  • Thermocouples HB CC 5G041
  • H01H37/32@C
  • Shape memory metals HB CC 5G041
  • H01H37/32@D
  • Combinations of bimetal and different temperature detecting elements HB CC 5G041
  • H01H37/32@Z
  • Others (superconductive elements) HB CC 5G041
  • H01H37/34
  • ...Means for transmitting heat thereto, e.g. capsule remote from contact member HB CC 5G041
  • H01H37/36
  • ...actuated due to expansion or contraction of a fluid with or without vaporisation (the fluid forming a contact of the switch H01H 29/04, H01H 29/30) HB CC 5G041
  • H01H37/38
  • ....with bellows HB CC 5G041
  • H01H37/40
  • ....with diaphragm HB CC 5G041
  • H01H37/42
  • ....with curled flexible tube, e.g. Bourdon tube HB CC 5G041
  • H01H37/44
  • ....with piston and cylinder HB CC 5G041
  • H01H37/46
  • ...actuated due to expansion or contraction of a solid (deflection of a bimetallic element H01H 37/52) HB CC 5G041
  • H01H37/48
  • ....with extensible rigid rods or tubes HB CC 5G041
  • H01H37/48@A
  • Lateral direction HB CC 5G041
  • H01H37/48@B
  • Axial direction HB CC 5G041
  • H01H37/48@C
  • Tensile rotation HB CC 5G041
  • H01H37/48@D
  • Combinations of multiple directions HB CC 5G041
  • H01H37/48@Z
  • Others HB CC 5G041
  • H01H37/50
  • ....with extensible wires under tension HB CC 5G041
  • H01H37/52
  • ...actuated due to deflection of bimetallic element HB CC 5G041
  • H01H37/52@A
  • Contacts directly mounted on diaphragms HB CC 5G041
  • H01H37/52@B
  • Bimetals pushing contact members HB CC 5G041
  • H01H37/52@C
  • .With quick-motion mechanisms HB CC 5G041
  • H01H37/52@D
  • ..With quick-motion mechanisms of micro switch types HB CC 5G041
  • H01H37/52@E
  • Bimetals as a piece part for switches HB CC 5G041
  • H01H37/52@F
  • Using special bimetals e.g. spiral HB CC 5G041
  • H01H37/52@G
  • Methods for manufacturing bimetals HB CC 5G041
  • H01H37/52@Z
  • Others HB CC 5G041
  • H01H37/54
  • ....wherein the bimetallic element is inherently snap acting HB CC 5G041
  • H01H37/54@A
  • By disk shaped bimetals HB CC 5G041
  • H01H37/54@B
  • .Contacts directly mounted on disk diaphragms HB CC 5G041
  • H01H37/54@C
  • By snap action bimetals HB CC 5G041
  • H01H37/54@D
  • .Contacts directly mounted on snap action bimetals HB CC 5G041
  • H01H37/54@Z
  • Others HB CC 5G041
  • H01H37/56
  • ....having spirally wound or helically wound bimetallic element HB CC 5G041
  • H01H37/56@A
  • Swirl types HB CC 5G041
  • H01H37/56@B
  • Spiral types HB CC 5G041
  • H01H37/56@Z
  • Others HB CC 5G041
  • H01H37/58
  • ...actuated due to thermally controlled change of magnetic permeability HB CC 5G018
  • H01H37/58@A
  • Reed switch types HB CC 5G018
  • H01H37/58@E
  • .With means for mounting or securing HB CC 5G018
  • H01H37/58@H
  • Flying switch types HB CC 5G018
  • H01H37/58@J
  • Magnetism and electricity conversion types HB CC 5G018
  • H01H37/58@K
  • Suction retaining type HB CC 5G018
  • H01H37/58@L
  • .With repulsion forces by magnets HB CC 5G018
  • H01H37/58@M
  • .With repulsion forces by bimetals or shape memory metals HB CC 5G018
  • H01H37/58@N
  • .With repulsion forces by leaf springs HB CC 5G018
  • H01H37/58@Q
  • .With repulsion forces by coil springs HB CC 5G018
  • H01H37/58@R
  • ..Linear motions by repulsion forces HB CC 5G018
  • H01H37/58@Z
  • Others HB CC 5G018
  • H01H37/60
  • ..Means for producing snap action (inherent in bimetallic element H01H 37/54; caused by a magnet H01H 37/66) HB CC 5G018
  • H01H37/62
  • ..Means other than thermal means for introducing a predetermined time delay HB CC 5G018
  • H01H37/64
  • ..Contacts HB CC 5G018
  • H01H37/64@A
  • Multiple contacts HB CC 5G018
  • H01H37/64@B
  • Wiping contacts HB CC 5G018
  • H01H37/64@C
  • Auxiliary contacts HB CC 5G018
  • H01H37/64@Z
  • Others HB CC 5G018
  • H01H37/66
  • ...Magnetic reinforcement of contact pressure; Magnet causing snap action HB CC 5G018
  • H01H37/68
  • ...sealed in evacuated or gas-filled tube HB CC 5G018
  • H01H37/70
  • ...Resetting means HB CC 5G018
  • H01H37/72
  • .Switches in which the opening movement and the closing movement of a contact are effected respectively by heating and cooling or vice versa HB CC 5G018
  • H01H37/74
  • .Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling HB CC 5G018
  • H01H37/74@A
  • Using bimetals HB CC 5G018
  • H01H37/74@B
  • Using expansion or contraction of heat sensing materials HB CC 5G018
  • H01H37/74@Z
  • Others HB CC 5G018
  • H01H37/76
  • ..Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material HB CC 5G502
  • H01H37/76@A
  • Characterised by operating principles HB CC 5G502
  • H01H37/76@B
  • .Current not drawing through temperature sensing materials HB CC 5G502
  • H01H37/76@C
  • ..Using helical springs HB CC 5G502
  • H01H37/76@D
  • ..Using leaf springs HB CC 5G502
  • H01H37/76@E
  • .Current drawing through temperature sensing materials HB CC 5G502
  • H01H37/76@F
  • ..Fusing temperature sensing materials HB CC 5G502
  • H01H37/76@G
  • ..Anchored by temperature sensing materials HB CC 5G502
  • H01H37/76@H
  • ..Flowing contacts HB CC 5G502
  • H01H37/76@J
  • ..Resin contacts HB CC 5G502
  • H01H37/76@K
  • Characterised by mounting or assembling HB CC 5G502
  • H01H37/76@L
  • Characterised by manufacturing methods HB CC 5G502
  • H01H37/76@P
  • Board type thermal fuses HB CC 5G502
  • H01H37/76@Q
  • .Chip type thermal fuses HB CC 5G502
  • H01H37/76@R
  • .Inserting type thermal fuses HB CC 5G502
  • H01H37/76@Z
  • Others HB CC 5G502
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