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This page displays all 「FI」 in main group H01G4/00. |
HB:Handbook | ||||
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CC:Concordance | |||||
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Fixed capacitors; Processes of their manufacture (electrolytic capacitors H01G9/00) [2] | HB | CC | 5E082 | |
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Manufacturing method | HB | CC | 5E082 | |
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Structures | HB | CC | 5E082 | |
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Others | HB | CC | 5E082 | |
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.Details [6] | HB | CC | 5E082 | |
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..Electrodes [6] | HB | CC | 5E082 | |
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...Selection of materials [6] | HB | CC | 5E082 | |
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....fried electrodes | HB | CC | 5E082 | |
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...Form of self-supporting electrodes [6] | HB | CC | 5E082 | |
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...Form of non-self-supporting electrodes [6] | HB | CC | 5E082 | |
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...Special provisions for self-healing [6] | HB | CC | 5E082 | |
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..Dielectrics [6] | HB | CC | 5E082 | |
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...Gas or vapour dielectrics [2, 6] | HB | CC | 5E082 | |
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...Liquid dielectrics [2, 6] | HB | CC | 5E082 | |
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...Solid dielectrics [2, 6] | HB | CC | 5E082 | |
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....Inorganic dielectrics [2, 6] | HB | CC | 5E082 | |
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Using mica | HB | CC | 5E082 | |
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Vapour deposited | HB | CC | 5E082 | |
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Others | HB | CC | 5E082 | |
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.....Metal-oxide dielectrics [2, 6] | HB | CC | 5E082 | |
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......Using glass | HB | CC | 5E082 | |
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.....Ceramic dielectrics [2, 6] | HB | CC | 5E001 | |
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......characterised by the ceramic dielectric material (H01G 4/12 720, H01G 4/12 810 take precedence) | HB | CC | 5E001 | |
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.......based on titanium oxides or titanates (H01G 4/12 450 takes precedence) | HB | CC | 5E001 | |
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........based on alkaline earth titanates | HB | CC | 5E001 | |
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.......based on zirconium oxides or zirconates (H01G 4/12 630 takes precedence) | HB | CC | 5E001 | |
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........containing also titanates | HB | CC | 5E001 | |
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.......based on niobium or tungsteen, tantalum oxides or niobates, tantalates | HB | CC | 5E001 | |
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........containing also zirconium oxides or zirconates | HB | CC | 5E001 | |
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......semiconductive ceramic capacitors | HB | CC | 5E001 | |
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.......with grain boundary layer | HB | CC | 5E001 | |
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......containing a glassy phase, e.g. glass ceramic | HB | CC | 5E001 | |
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....Organic dielectrics [2, 6] | HB | CC | 5E082 | |
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.....vapour deposited | HB | CC | 5E082 | |
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.....of fibrous material, e.g. paper [2, 6] | HB | CC | 5E082 | |
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.....of synthetic material, e.g. derivatives of cellulose (H01G4/16 takes precedence) [2, 6] | HB | CC | 5E082 | |
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......Derivatives of cellulose (H01G 4/14 500 takes precedence) | HB | CC | 5E082 | |
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......halogenated (H01G 4/14 500 takes precedence) | HB | CC | 5E082 | |
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...using combinations of dielectrics from more than one of groups H01G4/02-H01G4/06 (H01G4/12 takes precedence) [2, 6] | HB | CC | 5E082 | |
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....fibrous material or synthetic material | HB | CC | 5E082 | |
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....inorganic and synthetic material | HB | CC | 5E082 | |
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....impregnated [2, 6] | HB | CC | 5E082 | |
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.....characterised by the composition of the impregnant | HB | CC | 5E082 | |
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......halogenated | HB | CC | 5E082 | |
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..Housing; Encapsulation [2006.01] | HB | CC | 5E001 | |
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...Encapsulation for ceramic capacitors | HB | CC | 5E082 | |
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...Housing for film capacitors | HB | CC | 5E082 | |
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..Terminals [6] | HB | CC | 5E076 | |
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Characterised by structure of mounting part to substrates | HB | CC | 5E076 | |
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Characterised by structure of connection part to electrodes | HB | CC | 5E076 | |
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Lead frame or chain lead structures | HB | CC | 5E076 | |
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Characterised by materials or cross sectional structures of lead | HB | CC | 5E076 | |
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Characterized by mounting on chassis or other arrangements | HB | CC | 5E076 | |
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Characterized by mounting on moulds or other arrangements | HB | CC | 5E076 | |
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Related to connections to multiple parts | HB | CC | 5E076 | |
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Terminals of special capacitors, e.g. penetrating type, thick-film, thin-film capacitors terminals | HB | CC | 5E076 | |
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Terminals of capacitors using organic dielectrics | HB | CC | 5E076 | |
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.cores or core closings | HB | CC | 5E076 | |
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.terminals of resin injection seal type or mould type capacitors | HB | CC | 5E076 | |
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.related to protecting devices | HB | CC | 5E076 | |
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.related to connections of multiple elements | HB | CC | 5E076 | |
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.Chipped | HB | CC | 5E076 | |
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Chip type with lead | HB | CC | 5E076 | |
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Others | HB | CC | 5E076 | |
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...electrically connecting two or more layers of a stacked or rolled capacitor [6] | HB | CC | 5E076 | |
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having an inorganic dielectric [2] | HB | CC | 5E076 | |
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Characterised by the material of the terminals | HB | CC | 5E076 | |
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Connecting electrodes and terminals mechanically or by welding or soldering | HB | CC | 5E076 | |
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Others | HB | CC | 5E076 | |
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...leading through the housing, i.e. lead-through [6] | HB | CC | 5E076 | |
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...the capacitive element surrounding the terminal [6] | HB | CC | 5E076 | |
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....Tabs between the layers of a rolled electrode [6] | HB | CC | 5E076 | |
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...the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) [6] | HB | CC | 5E076 | |
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...the terminals being coated on the capacitive element (H01G4/232 takes precedence) [6] | HB | CC | 5E076 | |
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Related to metallikon, conductive paints, soldering or depositing | HB | CC | 5E076 | |
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.characterized by metallikon materials or structures of conductive paints, soldering or depositing | HB | CC | 5E076 | |
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.characterized by terminal connection by metallikon, conductive paints, soldring or depositing | HB | CC | 5E076 | |
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Leadless chip type | HB | CC | 5E076 | |
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Others | HB | CC | 5E076 | |
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..Means for correcting the capacitance value [6] | HB | CC | 5E082 | |
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..Temperature compensation means [6] | HB | CC | 5E082 | |
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.Folded capacitors [2] | HB | CC | 5E082 | |
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.Tubular capacitors [2] | HB | CC | 5E082 | |
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.Stacked capacitors (H01G4/33 takes precedence) [2, 6] | HB | CC | 5E082 | |
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..obtained by injection of metal in cavities formed in a ceramic body | HB | CC | 5E082 | |
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..obtained from a another capacitor | HB | CC | 5E082 | |
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..made by thin film techniques | HB | CC | 5E082 | |
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..made by transfer techniques | HB | CC | 5E082 | |
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..structures or materials | HB | CC | 5E082 | |
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Laminated structures | HB | CC | 5E082 | |
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Internal electrodes | HB | CC | 5E082 | |
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.structures of internal electrodes | HB | CC | 5E082 | |
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.Materials of internal electrodes | HB | CC | 5E082 | |
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External electrodes | HB | CC | 5E082 | |
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.structures of external electrodes | HB | CC | 5E082 | |
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.Materials of external electrodes | HB | CC | 5E082 | |
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.Leads connecting external electrodes | HB | CC | 5E082 | |
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Dielectrics | HB | CC | 5E082 | |
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.structures of dielectrics | HB | CC | 5E082 | |
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.Materials of dielectrics | HB | CC | 5E082 | |
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.characterised by dielectric body of cover layer | HB | CC | 5E082 | |
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.characterised by dielectric body of side margin | HB | CC | 5E082 | |
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Chip type | HB | CC | 5E082 | |
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Coaxial type | HB | CC | 5E082 | |
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Connected in series | HB | CC | 5E082 | |
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With safety arrangements | HB | CC | 5E082 | |
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Others | HB | CC | 5E082 | |
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..Manufacturing methods | HB | CC | 5E082 | |
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Trimming methods | HB | CC | 5E082 | |
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.Trimming method after winding around drum | HB | CC | 5E082 | |
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.Trimming by crushing after winding | HB | CC | 5E082 | |
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Manufacturing method of internal electrodes | HB | CC | 5E082 | |
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Manufacturing method of external electrodes | HB | CC | 5E082 | |
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Laminating methods | HB | CC | 5E082 | |
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Others | HB | CC | 5E082 | |
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..Ceramic capacitors | HB | CC | 5E001 | |
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...semiconductor magnetic capacitors | HB | CC | 5E001 | |
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....Grain boundary insulated or reduced and re-oxdised type | HB | CC | 5E001 | |
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....Grain boundary insulated type | HB | CC | 5E001 | |
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....Reduced and re-oxdised type | HB | CC | 5E001 | |
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...Laminated ceramic capacitors (H01G 4/30 501 takes precedence) | HB | CC | 5E001 | |
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....structures | HB | CC | 5E001 | |
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.....Dielectrics | HB | CC | 5E001 | |
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.....Internal electrodes or external electrodes | HB | CC | 5E001 | |
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....Materials | HB | CC | 5E001 | |
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.....Dielectrics | HB | CC | 5E001 | |
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.....Internal electrodes or external electrodes | HB | CC | 5E001 | |
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....Manufacturing methods | HB | CC | 5E001 | |
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...Cylindrical, urn-shaped, pillar-shaped | HB | CC | 5E001 | |
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...Wound types | HB | CC | 5E001 | |
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...Printed board type, e.g. capacitors having thick or thin films | HB | CC | 5E001 | |
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....structures | HB | CC | 5E001 | |
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....Materials | HB | CC | 5E001 | |
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....Manufacturing methods | HB | CC | 5E001 | |
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...Penetrating type | HB | CC | 5E001 | |
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...ceramic capacitors in general, e.g. plate-shaped or U-shaped capacitors | HB | CC | 5E001 | |
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.Wound capacitors [2] | HB | CC | 5E082 | |
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..Structures | HB | CC | 5E082 | |
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Combination or laying out films | HB | CC | 5E082 | |
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Structures of film per se | HB | CC | 5E082 | |
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With safety arrangements | HB | CC | 5E082 | |
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Cooling pipe type | HB | CC | 5E082 | |
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Chip type | HB | CC | 5E082 | |
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Sheathes or containers | HB | CC | 5E082 | |
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Others | HB | CC | 5E082 | |
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...Leads or lead outlets | HB | CC | 5E082 | |
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Leads | HB | CC | 5E082 | |
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End surface electrodes, e.g. metallikon electrodes, etc. | HB | CC | 5E082 | |
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Others | HB | CC | 5E082 | |
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..Manufacturing methods | HB | CC | 5E082 | |
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Winding methods | HB | CC | 5E082 | |
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Others | HB | CC | 5E082 | |
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..film capacitors | HB | CC | 5E082 | |
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...structures or materials of film capacitors | HB | CC | 5E082 | |
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....structures or materials of metalic film capacitors | HB | CC | 5E082 | |
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structures of | HB | CC | 5E082 | |
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Materials of | HB | CC | 5E082 | |
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structures of dielectric films | HB | CC | 5E082 | |
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.Mixed with powders or granules | HB | CC | 5E082 | |
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.With mesh elements | HB | CC | 5E082 | |
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.Rough surfaces | HB | CC | 5E082 | |
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Materials of dielectric films | HB | CC | 5E082 | |
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With insulating materials located between metallised films | HB | CC | 5E082 | |
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Others | HB | CC | 5E082 | |
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....structures or materials of nonmetallized films | HB | CC | 5E082 | |
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Electrode foil | HB | CC | 5E082 | |
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Dielectric films | HB | CC | 5E082 | |
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.With charge-transfer type complexes | HB | CC | 5E082 | |
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.Complex salts | HB | CC | 5E082 | |
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.simple salts | HB | CC | 5E082 | |
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.Unwoven fabrics | HB | CC | 5E082 | |
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Combinations or arrangements of electrode foils and dielectric films | HB | CC | 5E082 | |
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Gluing electrode foils and dielectric films | HB | CC | 5E082 | |
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Others | HB | CC | 5E082 | |
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....structure of external electrodes, e.g. structure of metallikon electrodes | HB | CC | 5E082 | |
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....leads connecting to electrodes end surfaces | HB | CC | 5E082 | |
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....housing, moulds, containers or injection of gas | HB | CC | 5E082 | |
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....immersed | HB | CC | 5E082 | |
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....chip type | HB | CC | 5E082 | |
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....connected in series | HB | CC | 5E082 | |
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....with safety arrangements, e.g. fuse electrodes | HB | CC | 5E082 | |
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...manufacturing methods of film capacitors | HB | CC | 5E082 | |
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....manufacturing methods of metallised films | HB | CC | 5E082 | |
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Manufacturing methods of capacitor forming electrodes, e.g. deposition method | HB | CC | 5E082 | |
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Manufacturing methods of dielectric films | HB | CC | 5E082 | |
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Others | HB | CC | 5E082 | |
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....manufacturing methods of nonmetallized films | HB | CC | 5E082 | |
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Manufacturing methods of electrode foils | HB | CC | 5E082 | |
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Manufacturing methods of dielectric films | HB | CC | 5E082 | |
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.By radiation processing, e.g. light or electron beams | HB | CC | 5E082 | |
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.By electric discharge processing | HB | CC | 5E082 | |
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Others | HB | CC | 5E082 | |
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....Heat treatments | HB | CC | 5E082 | |
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....Compressing or machining | HB | CC | 5E082 | |
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....Trimming | HB | CC | 5E082 | |
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....Treatments by multiple processes | HB | CC | 5E082 | |
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.Thin- or thick-film capacitors [6] | HB | CC | 5E082 | |
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..Thick film capacitors, e.g. dielectrics formed by coating or printing | HB | CC | 5E082 | |
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..Thin film capacitors, e.g. dielectrics formed by depositing or anodising | HB | CC | 5E082 | |
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.Feed-through capacitors or anti-noise capacitors [6] | HB | CC | 5E082 | |
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..Cylindrical types | HB | CC | 5E082 | |
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..Wound types | HB | CC | 5E082 | |
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..Coaxial types | HB | CC | 5E082 | |
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..Multi-layer types | HB | CC | 5E082 | |
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..Combined types | HB | CC | 5E082 | |
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.Multiple capacitors, i.e. structural combinations of fixed capacitors [2] | HB | CC | 5E082 | |
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Consisting of fixed capacitors only | HB | CC | 5E082 | |
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single unit multiple capacitors | HB | CC | 5E082 | |
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Others | HB | CC | 5E082 | |
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.Structural combinations of fixed capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations [2] | HB | CC | 5E082 | |
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Not containing other capacitors than fixed type | HB | CC | 5E082 | |
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Others | HB | CC | 5E082 | |
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..Combinations with resistance elements | HB | CC | 5E082 | |
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Not containing other capacitors than fixed type | HB | CC | 5E082 | |
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Others | HB | CC | 5E082 | |
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...Combinations with resistance elements having nonlinearity with voltage | HB | CC | 5E082 | |
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Not containing other capacitors than fixed type | HB | CC | 5E082 | |
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Others | HB | CC | 5E082 | |
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...Combinations with deposited resistance | HB | CC | 5E082 | |
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Not containing other capacitors than fixed type | HB | CC | 5E082 | |
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Others | HB | CC | 5E082 | |
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...For protecting from over-voltages | HB | CC | 5E082 | |
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Not containing other capacitors than fixed type | HB | CC | 5E082 | |
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Others | HB | CC | 5E082 | |
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....With discharge gaps or discharge resistances | HB | CC | 5E082 | |
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Not containing other capacitors than fixed type | HB | CC | 5E082 | |
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Others | HB | CC | 5E082 | |
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..Combinations with inductance elements | HB | CC | 5E082 | |
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Not containing other capacitors than fixed type | HB | CC | 5E082 | |
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Others | HB | CC | 5E082 | |