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This page displays all 「FI」 in main group B28D5/00. |
HB:Handbook | ||||
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CC:Concordance | |||||
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Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (working by grinding or polishing B24; for artistic purposes B44B; by non-mechanical methods C04B 41/00; non-mechanical after-treatment of single crystals C30B 33/00) [3] | HB | CC | 3C069 | |
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Semiconductor wafer bending or cutting | HB | CC | 3C069 | |
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Others | HB | CC | 3C069 | |
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.by rotary tools, e.g. drills | HB | CC | 3C069 | |
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Semiconductor machining | HB | CC | 3C069 | |
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.Ingot slicing | HB | CC | 3C069 | |
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..using an inner periphery blade tool | HB | CC | 3C069 | |
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...Tool attachment | HB | CC | 3C069 | |
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...Tool feed (F takes precedence.) | HB | CC | 3C069 | |
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...Tool camber prevention | HB | CC | 3C069 | |
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...Work handling or feed | HB | CC | 3C069 | |
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Others | HB | CC | 3C069 | |
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.by tools other than of rotary type, e.g. reciprocating tools | HB | CC | 3C069 | |
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Semiconductor machining | HB | CC | 3C069 | |
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.Ingot slicing | HB | CC | 3C069 | |
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..using a wire tool | HB | CC | 3C069 | |
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..using a blade tool | HB | CC | 3C069 | |
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Others | HB | CC | 3C069 | |