|
This page displays all 「FI」 in main group B24B37/00. |
HB:Handbook | ||||
|
CC:Concordance | |||||
|
|
Lapping machines or devices; accessories therefor (B24B3/00 takes precedence) [1, 2012.01] | HB | CC | 3C158 | |
|
|
Magnetic lapping | HB | CC | 3C158 | |
|
|
Vibration lapping | HB | CC | 3C158 | |
|
|
Hole lapping (moving a polishing agent reciprocally in the tube by wires, etc. to polish the inside thereof B24B5/40C) | HB | CC | 3C158 | |
|
|
Lapping abrasive grains or working liquid (related to abrasive grains C09C 1/68, C09K 3/14, C08J 5/14) | HB | CC | 3C158 | |
|
|
characterized by supply of the polishing liquid, e.g. utilising the hole on the surface plate or pad, control of the flow rate or supply time, retaining the polishing liquid on the machined part (polishing liquid temperature control B24B 37/015) | HB | CC | 3C158 | |
|
|
Others | HB | CC | 3C158 | |
|
|
.Control means for lapping machines or devices [2012.01] | HB | CC | 3C158 | |
|
|
characterised by control of polishing pressure on lapping | HB | CC | 3C158 | |
|
|
worked dimensions on plane lapping; control of a gap between the upper and lower surface plates | HB | CC | 3C158 | |
|
|
Others | HB | CC | 3C158 | |
|
|
..Devices or means for detecting lapping completion [2012.01] | HB | CC | 3C158 | |
|
|
..Temperature control [2012.01] | HB | CC | 3C158 | |
|
|
.designed for working surfaces of revolution [1, 2012.01] | HB | CC | 3C158 | |
|
|
..designed for working spherical surfaces [2012.01] | HB | CC | 3C158 | |
|
|
.designed for working plane surfaces [1, 2012.01] | HB | CC | 3C158 | |
|
|
..characterised by the movement of the work or lapping tool [2012.01] | HB | CC | 3C158 | |
|
|
...for double side lapping [2012.01] | HB | CC | 3C158 | |
|
|
...for single side lapping [2012.01] | HB | CC | 3C158 | |
|
|
.Lapping tools [2012.01] | HB | CC | 3C158 | |
|
|
..Lapping plates for working plane surfaces [2012.01] | HB | CC | 3C158 | |
|
|
characterised by hole structure | HB | CC | 3C158 | |
|
|
for preventing deformation | HB | CC | 3C158 | |
|
|
polishing on the surface plates | HB | CC | 3C158 | |
|
|
attaching a pad or a polishing cloth | HB | CC | 3C158 | |
|
|
Others | HB | CC | 3C158 | |
|
|
...characterised by the composition or properties of the plate materials [2012.01] | HB | CC | 3C158 | |
|
|
...characterised by the shape of the lapping plate surface, e.g. grooved [2012.01] | HB | CC | 3C158 | |
|
|
..Lapping pads for working plane surfaces [2012.01] | HB | CC | 3C158 | |
|
|
...characterised by a multi-layered structure [2012.01] | HB | CC | 3C158 | |
|
|
...characterised by the composition or properties of the pad materials[2012.01] | HB | CC | 3C158 | |
|
|
Elastic bodies | HB | CC | 3C158 | |
|
|
.Resin | HB | CC | 3C158 | |
|
|
..Polyurethane, polyester, rubber | HB | CC | 3C158 | |
|
|
.Cloth | HB | CC | 3C158 | |
|
|
..Non-woven fabric | HB | CC | 3C158 | |
|
|
.Raised cloth | HB | CC | 3C158 | |
|
|
Others | HB | CC | 3C158 | |
|
|
...characterised by the shape of the lapping pad surface, e.g. grooved [2012.01] | HB | CC | 3C158 | |
|
|
.Lapping carriers [2012.01] | HB | CC | 3C158 | |
|
|
..for double side lapping of plane surfaces [2012.01] | HB | CC | 3C158 | |
|
|
..for single side lapping of plane surfaces [2012.01] | HB | CC | 3C158 | |
|
|
by adsorption, e.g. by vacuum or suction cups | HB | CC | 3C158 | |
|
|
Adhesives; by wax, etc. | HB | CC | 3C158 | |
|
|
characterised by retaining sheets | HB | CC | 3C158 | |
|
|
.characterised by a multi-layered structure | HB | CC | 3C158 | |
|
|
characterised by pressure-supplying structure | HB | CC | 3C158 | |
|
|
Others | HB | CC | 3C158 | |
|
|
...Retaining rings [2012.01] | HB | CC | 3C158 | |
|
|
characterised by vertically movable structure | HB | CC | 3C158 | |
|
|
Others | HB | CC | 3C158 | |
|
|
.Accessories [2012.01] | HB | CC | 3C158 | |