|
This page displays all 「FI」 in main group B24B1/00. |
HB:Handbook | ||||
|
CC:Concordance | |||||
|
|
Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes [2006.01] | HB | CC | 3C049 | |
|
|
Semiconductor grinding or polishing method (related to electrical characteristics R H 01 L 21/304) | HB | CC | 3C049 | |
|
|
Crystal polishing method or device (irrelevant to the polishing means and irrelevant to the plane, end surface diagonal plane, and curved surface, however, excluding those having sub-categories, e.g. jewel B 24 B 9/16, stylus B 24 B 19/16 A, crystal oscillator B 24 B 1/00 C, semiconductor not included) | HB | CC | 3C049 | |
|
|
Crystal oscillator polishing method or device (Refer to B 24 B 13/00 E.) | HB | CC | 3C049 | |
|
|
Magnetic recording medium or disk board polishing method | HB | CC | 3C049 | |
|
|
characterized by temperature control | HB | CC | 3C049 | |
|
|
characterized by the sequence | HB | CC | 3C049 | |
|
|
Others, e.g. composite machining method with another machining and not categorized into the others, e.g. B 23 H 5/00 | HB | CC | 3C049 | |
|
|
.subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency (involving oscillating or vibrating containers B24B 31/06; superfinishing surfaces on work, e.g. by means of abrading blocks reciprocating with high frequency B24B 35/00) [4] | HB | CC | 3C049 | |
|
|
Ultrasonic lapping | HB | CC | 3C049 | |
|
|
Ultrasonic vibration as the vibration given to the tool | HB | CC | 3C049 | |
|
|
.Ultrasonic vibration given in the normal line direction of the polished surface | HB | CC | 3C049 | |
|
|
Other than ultrasonic vibration as the vibration given to the tool | HB | CC | 3C049 | |
|
|
.Vibration given in the normal line direction of the polished surface | HB | CC | 3C049 | |
|
|
Others (Refer to B 23 B 1/00 for other than grinding or polishing.) | HB | CC | 3C049 | |