F-Term-List

H05K3/46-3/46@Z

AA00
SHAPES AND CONSTRUCTIONS OF MULTI-LAYER

AA01

AA02

AA03

AA04

AA05

AA06

. Specified shapes and structures of basement

. . Insulating substrate

. . Metallic insulating substrate

. . Having wirings inside the substrate

. . Single faced plate

. . Both faced plate

AA11

AA12

AA13

AA14

AA15

AA16

AA17

. Specified shapes and constructions of layers

. . Insulating layer

. . . Dielectric layer

. . . Resistance layer

. . . Conductive layer

. . . Adhesive layer

. . . Over coat layer

AA21

AA22

AA23

AA24

AA25

AA26

AA27

AA28

AA29

. Specific shapes and constructions between substrates and layers

. . . Between substrates

. . . . . Dielectric property

. . . . . Contractile property

. . . . . Thermal expansion property

. . . Substrates and insulating layers

. . . Substrates and dielectric layers

. . . Substrates and resistance layers

. . . Substrates and conductive layers

AA31

AA32

AA33

AA34

AA35

AA36

AA37

AA38

AA39

. Specific shapes and constructions between layers

. . . Conductive layers and insulating layers

. . . Conductive layers and dielectric layers

. . . Conductive layers and resistance layers

. . . Conductive layers and conductive layers

. . . Insulating layers and dielectric layers

. . . Insulating layers and resistance layers

. . . Between insulating layers

. . . Dielectric layers and resistance layers

AA41

AA42

AA43

AA45

. Specified shapes and construction of through-holes

. . . Through-holes between all the layers

. . . Interstitial via hole

. Specified shapes and constructions of clearance holes

AA51

AA52

AA53

AA54

AA55

AA60

. Specified number of the layers

. . Triple layered plates

. . Quad layered plates

. . Five-nine layered plates

. . Plates having more than ten layers

. Others

BB00
SHAPES AND CONSTRUCTIONS OF WIRING PATTERN

BB01

BB02

BB03

BB04

BB06

BB07

. Specified wiring pattern

. . . Signaling layers

. . . Layers of power source

. . . Ground layers

. Arrangement of signaling layers, power source layers and ground layers

. . . Power source layers and ground layers installed inside the layers

BB11

BB12

BB13

BB15

BB16

BB17

BB20

. Arrangements, shapes and constructions between upper and lower portions of wiring patterns

. . Orthogonal pattern of upper and lower portion of wiring patterns

. . Arrangement of through-holes in the cross point of upper and lower portion of wiring patterns

. Specified values such as width and thickness of wiring etc.

. Arrangements, shapes and constructions of land

. Crossover wiring

. Others

CC00
MATERIALS OF MULTI-LAYERS

CC01

CC02

CC03

CC04

CC05

CC06

CC08

CC09

CC10

. Insulating materials

. . . Sheet shaped base-materials

. . . Paper base-materials

. . . Glass fabric base-materials

. . . Synthetic fiber base-materials

. . . Composite base-materials

. . . Synthetic resin systems

. . . Epoxy resin systems

. . . Polyimide resin systems

CC12

CC13

CC14

CC16

CC17

CC18

CC19

. . . Polyester resin systems

. . . Phenol resin systems

. . . Fluorine resin systems

. . . Inorganic systems

. . . . . High temperature sintered base-materials (Almina systems etc.)

. . . Low temperature sintered base-materials (Glass systems etc.)

. . . High thermal conductive base-materials (silicon carbide systems etc.)

CC21

CC25

. Dielectric materials

. Resistance materials

CC31

CC32

CC33

CC34

CC35

CC36

CC37

CC38

CC39

CC40

. Conductive materials

. . Coppers

. . Tins

. . Aluminums

. . Molybdenum

. . Tungsten

. . Nickels

. . Golds

. . Silvers

. . Solders

CC41

CC42

CC43

CC46

. Adhesive materials

. . . Conductive adhesives

. . . Additives

. Over coating materials

CC51

CC52

CC53

CC54

CC55

CC57

CC58

CC60

. Processing agents used for print wiring formation

. . . Resist

. . . . . For screens

. . . . . For plating

. . . . . For etchings

. . . Plating solutions

. . . Etching solutions

. Others

DD00
METHODS OF FORMATION OF EACH LAYER

DD01

DD02

DD03

DD04

DD05

DD07

DD09

. Methods of insulating layer formation

. . Adhesion of insulating materials such as adhesive sheet

. . Paintings

. . Gas phase

. . Oxidized materials

. Methods of layer formation of dielectric bodies

. Methods of layer formation of resistance bodies

DD11

DD12

DD13

DD15

DD16

DD17

. Methods of layer formation of conductive bodies

. . Adhesion of conductive materials such as conductive sheet etc.

. . Paintings

. . Gas phase

. . . Evaporation

. . . Spattering

DD22

DD23

DD24

DD25

DD28

. . . Plating

. . . Non-electrolytic plating

. . . Electrolytic plating

. . . . . Combined use of non-electrolytic and electrolytic plating

. . Discrete wires

DD31

DD32

DD33

DD34

DD35

. Methods of wiring patterns

. . Sub tractive method

. . Additive method

. . . Printing methods with conductive inks

. . Discrete wiring methods

DD42

DD43

DD44

DD45

DD46

DD47

DD48

DD50

. . Specified methods of image transfer

. . . Methods

. . . . Picture methods

. . . . Screen printing methods

. . . Resist

. . . . Plating resist

. . . . Etching resist

. Others

EE00
METHODS OF FORMATION OF MULTI-LAYERS

EE01

EE02

EE03

EE04

EE05

EE06

EE07

EE08

EE09

. Laminated types (Most of them are heat pressure bonding)

. . Specified lamination methods

. . . Pin lamination method

. . . Mass lamination method

. . Specified materials

. . . Lamination materials used for inner layered circuits

. . . Lamination materials used for outer layered circuits

. . . Sheets

. . . . Prepreg

EE12

EE13

EE14

EE15

EE16

EE17

EE18

EE19

EE20

. . . Adhesives

. . . Metallic foils

. . Specified conditions of processing

. . Positioning

. . . Referential holes for positioning

. . . Marking for positioning

. . Adhesion between layers

. . . Roughening of inner layer materials

. . Interlaminar insulation

EE21

EE22

EE23

EE24

EE25

EE26

EE27

EE28

EE29

EE30

. Green sheet methods

. . Specified lamination methods

. . . Printing lamination methods

. . . Sheet lamination methods

. . Specified conditions of processing

. . . Conditions of resin extraction

. . . Sintering conditions

. . Interlaminar adhering

. . Green sheet

. . Increase of the number of laminations

EE31

EE32

EE33

EE34

EE35

EE36

EE37

EE38

EE39

. Build-up types

. . Thick film conductors

. . Thin film conductors

. . . Conductors mixed with thick and thin films

. . Specified conditions of processing

. . . Sintering conditions

. . Slips of interlaminar

. . Adhesions of interlaminar

. . Interlaminar insulation

EE41

EE42

EE43

EE44

EE47

EE50

. Complexed types (Most of them are by joint)

. . For only FPC

. . For only rigid plate

. . . Plates mixed with FPC and rigid plates

. Discrete wiring types

. Others

FF00
METHODS OF CONNECTION BETWEEN CONDUCTIVE LAYERS

FF01

FF02

FF03

FF04

FF05

FF06

FF07

FF08

FF09

FF10

. Making holes (Through-holes etc.)

. . Pre-processing

. . . Smear processing

. . . Plating

. . . Specified composition

. . . . Soldering

. . . . Coppers

. . . . Tins

. . . . Golds

. . . . Nickels

FF12

FF13

FF14

FF15

FF17

FF18

FF19

. . . . . Specified methods

. . . . Non-electrolytic plating

. . . . Electrolytic plating

. . . . . . . Combined use of non-electrolytic and electrolytic plating

. . Gas phase

. . Conductive paintings

. . Using solders

FF21

FF22

FF23

FF24

FF27

FF28

. Connection conductive layers each other

. . Direct connection

. . Indirect connection

. . . Protrusion conductors

. Specified layers of target for connection

. . Connected layers using as layers between selected layers

FF31

FF32

FF33

FF34

FF35

FF36

FF37

. Mechanical lamination

. . Jumper lines

. . Pins

. . Connecting terminals

. . Extension of embossment or wiring conductors

. . Joint of substrates

. . . Metallic sphere

FF41

FF42

FF45

FF50

. Special connection methods

. . . Using lateral surface of basements and substrates

. Mounting of components

. Others

GG00
MEANS OF MANUFACTURING, PROCESSING, TREATMENT

GG01

GG02

GG03

GG04

GG05

GG06

GG07

GG08

GG09

GG10

. Manufacturing processes and devices

. . Manufacturing processes of print wiring board materials

. . Manufacturing processes of green sheet method

. . . Production of green sheets

. . . Punching

. . . Conductive printing

. . . Insulating printing

. . . . . Crimping, lamination and cut of external forms

. . . . . Remove of resins, sinter

. . . Finish

GG12

GG13

GG14

GG15

GG16

GG17

GG18

GG19

. . Production processes of art work

. . . Treatments and processes with films

. . Processes of material cutting

. . Processes of boring

. . Processes of clean

. . Processes of plating

. . . Processes of forming pattern of photo

. . Processes of printing

GG22

GG23

GG24

GG25

GG26

GG27

GG28

. . Etching processes

. . Processes of resist removing (peeling)

. . . Processes of punching press

. . Processes of soldering

. . Processes of external forms

. . Processes of roughening treatment of inner layers

. . . Processes of lamination

GG31

GG32

GG33

GG34

GG36

GG37

GG38

GG40

. Methods of testing and inspection

. . Electrical inspection of discrete wires

. . Defect inspection of through-holes

. . . Apparatuses for testing and detection

. Repairing means

. . Repair for change of wires

. . Apparatuses used for repair

. Others

HH00
PURPOSE, PROBLEMS, EFFECTS

HH01

HH02

HH03

HH04

HH05

HH06

HH07

HH08

. Electrical characteristics

. . Low impedance

. . Matching of characteristic impedance

. . Reduction of crosstalk

. . Reduction of delaying time of transmission

. . Improvement of high frequency performance

. . . Electrically connecting properties

. . Insulating properties

HH11

HH13

HH16

HH17

HH18

. Mechanical characteristics

. Chemical characteristics

. Heat

. . . Thermal conductive properties and heat dispersing properties

. . Heat resistance

HH21

HH22

HH23

HH24

HH25

HH26

. Performance of productions

. . Downsizing

. . Lightweight

. . Thin construction

. . High performance of storage for wirings

. . Fine wirings

HH31

HH32

HH33

HH40

. Manufacturing and production

. . . Simplification and reduction of the number of processes

. . . Improvement of productivity and yield ratio

. Others

JJ00
MULTI-LAYERED PRINT WIRING BOARD IN WHICH ELECTRONIC COMPONENTS ARE MOUNTED (PACKAGED) OR FORMED

JJ01

JJ02

JJ03

JJ04

JJ06

. Exposed electronic components

. . Active electronic components

. . Passive electronic components

. . . Passive components constituted by a part of multi-layer circuits

. . Electronic components mounted on the concave portion formed on the surface of multi-layered print wiring boards

JJ11

JJ12

JJ13

JJ14

JJ15

JJ16

. Electronic components not exposed

. . Active electronic components

. . Passive electronic components

. . . Passive components constituted by a part of multi-layer circuits

. . Electronic components used as slave substrate

. . Air gaps in the regions contacting the electronic components

JJ22

JJ23

JJ24

JJ25

JJ26

JJ27

JJ28

JJ29

. . Embedding methods of electronic components

. . . Arrangements and embedding methods of electronic components on the upper surface of flat substrates

. . . . Embedding by using insulating substrates having through-holes or concave portions

. . . Arrangements and embedding methods of electronic components inside the concave portions formed in the substrate materials

. . . Arrangements and embedding methods of electronic components inside the through-holes formed in the substrate materials

. . . Embedding of electronic components by using fillers which are different from materials to form layers

. . . Electrode connection after embedding of electronic components

. . . Temporary attachment on the supporting members

5E316	PRODUCTION OF MULTI-LAYERED PRINT WIRING BOARD
	H05K3/46 -3/46@Z