| ReturnTo Theme-Group-Choice | Onelevelup |
| 4K057 | Etching and chemical polishing (i.e., glazing) | |
| C23F1/00 -4/04 | ||
| C23F4/00-4/04 | DA | DA00 PURPOSE OF DRY-ETCHING |
DA01 | DA02 | DA04 | DA05 | ||||||
| . Cleaning | . Damage prevention | . Smoothing | . Roughening | |||||||||
| DA11 | DA12 | DA13 | DA14 | DA16 | DA18 | DA19 | DA20 | |||||
| . Improvement of the precision of a process | . Improvement of anisotropy | . Improved selectivity | . Detection of the end-point | . Control of plasma | . Prevention of pollution | . Automation and energy conservation | . Others | |||||
| DB | DB00 MATERIAL BEING DRY-ETCHED |
DB01 | DB02 | DB03 | DB04 | DB05 | DB06 | DB07 | DB08 | |||
| . Metals and alloys | . . Iron (Fe) | . . Nickel (Ni) | . . Copper (Cu) | . . Aluminum (Al) | . . Silicon (Si) | . . Zinc (Zn) | . . Refractory metals | |||||
| DB11 | DB12 | DB15 | DB17 | DB20 | ||||||||
| . Materials with characteristic compositions | . Materials with a characteristic crystalline structure or surface | . Materials with a characteristic combination of materials | . Materials with characteristic processing areas | . Others | ||||||||
| DC | DC00 DRY-ETCHING PRETREATMENTS |
DC01 | DC04 | DC05 | DC06 | DC10 | ||||||
| . Heat treatments | . Marker treatments | . . Ion injection | . . Absorption or adsorption | . Others | ||||||||
| DD | DD00 DRY-ETCHING METHODS |
DD01 | DD02 | DD03 | DD04 | DD05 | DD06 | DD07 | DD08 | DD09 | DD10 | |
| . Plasma etching | . Spatter etching | . . Reactive-ion etching | . Ion-beam etching | . . Reactive-ion-beam etching | . Laser etching | . Isotropic etching | . Anisotropic etching | . Intermittent etching | . Others | |||
| DE | DE00 DRY-ETCHING GASES |
DE01 | DE02 | DE03 | DE04 | DE06 | DE07 | DE08 | DE09 | DE10 | ||
| . Chlorine and chlorine compounds | . . Carbon tetrachloride (CCl4) | . . Boron tetrachloride (BCl4) | . . Boron trichloride (BCl3) | . Fluorine and fluorine compounds | . . Perfluoroethane (C2F6) | . . Perfluoromethane (CF4) | . . Nitrogen trifluoride (NF3) | . . Hydrogen fluoride (HF) | ||||
| DE11 | DE14 | DE15 | DE20 | |||||||||
| . Bromide and bromide compounds | . Inert gases | . . Krypton (Kr) | . Others | |||||||||
| DG | DG00 CONTROL OF DRY-ETCHING CONDITIONS |
DG01 | DG02 | DG06 | DG07 | DG08 | ||||||
| . Materials being dry-etched | . . Temperature | . Gas conditions | . . Gas flow | . . Gas pressure | ||||||||
| DG11 | DG12 | DG13 | DG14 | DG15 | DG16 | DG17 | DG18 | DG20 | ||||
| . Device operation | . . Atmospheric composition | . . Atmospheric pressure | . . Atmospheric temperature | . . Power supply | . . Distance between electrodes | . . Quantity of irradiation of the ion beam | . . Angle of ion incidence | . Others | ||||
| DJ | DJ00 DRY-ETCHING END-POINT DETECTION |
DJ01 | DJ02 | DJ03 | DJ06 | DJ07 | DJ08 | DJ10 | ||||
| . Physical measurement | . Emission-analysis methods | . . Use of specific wavelength spectra data | . Mass spectrometry | . Optical measurement | . Laser interference methods | . Others | ||||||
| DK | DK00 DRY-ETCHING POST-TREATMENTS |
DK01 | DK03 | DK10 | ||||||||
| . Resin-coating treatments | . Resist removal | . Others | ||||||||||
| DM | DM00 DRY-ETCHING DEVICES |
DM01 | DM02 | DM03 | DM04 | DM05 | DM06 | DM07 | DM08 | DM09 | DM10 | |
| . Reaction chambers | . . Parallel flat plates | . . . Cathode-coupled types | . . . Anode-coupled types | . . . Application of a power supply to both electrodes | . . Electrode structures | . . . Loop grooves | . . . Hollow structures | . . Electrode-material properties | . . . Porous materials | |||
| DM12 | DM13 | DM14 | DM16 | DM17 | DM18 | DM19 | DM20 | |||||
| . . Ion sources | . . Movement of support tables | . . Coating treatments | . Means of supplying power | . . Number of power sources | . . Frequency of the power source | . . Types of voltage applied | . . Waveforms of voltage applied | |||||
| DM21 | DM22 | DM23 | DM24 | DM25 | DM28 | DM29 | ||||||
| . Means for control of ion flow | . . Magnetic field in the same direction as the ion flow | . . Magnetic field in the direction opposite of the ion flow | . . Magnetic fields that are at right angles to the ion flow | . . Solids that are scattered | . Plasma-generation means | . . Use of microwaves | ||||||
| DM31 | DM32 | DM33 | DM35 | DM36 | DM37 | DM38 | DM39 | DM40 | ||||
| . Matching means | . . Ground-electrode side | . . Power-supply side | . Support means | . Conveyance means | . Gas-supply means | . Vacuum-exhaust means | . Heating means and cooling means | . Others | ||||
| DN | DN00 DRY-ETCHING USES |
DN01 | DN02 | DN03 | DN04 | DN10 | ||||||
| . Electronic parts | . Electrodes | . Optical parts | . Samples for microscopes | . Others | ||||||||
| C23F1/00-3/06 | WA | WA00 WET-ETCHING PURPOSES |
WA01 | WA02 | WA03 | WA04 | WA05 | WA07 | WA08 | WA09 | WA10 | |
| . Cleaning | . Damage prevention | . Prevention of surface defects | . Smoothing | . Roughening | . Adhesiveness | . Mold-release properties | . Gloss | . Etching properties | ||||
| WA11 | WA12 | WA13 | WA14 | WA18 | WA19 | WA20 | ||||||
| . Improvement of the precision of the process | . Improvement of anistropy | . Improved selectivity | . End-point detection | . Prevention of pollution | . Automation and energy conservation | . Others | ||||||
| WB | WB00 MATERIAL TO BE WET-ETCHED |
WB01 | WB02 | WB03 | WB04 | WB05 | WB06 | WB07 | WB08 | |||
| . Metals and alloys | . . Iron (Fe) | . . Nickel (Ni) | . . Copper (Cu) | . . Aluminum (Al) | . . Silicon (Si) | . . Zinc (Zn) | . . Fireproof metals | |||||
| WB11 | WB12 | WB15 | WB17 | WB20 | ||||||||
| . Materials with a characteristic composition | . Materials with a characteristic crystalline structure surface | . Characteristic combinations of materials | . Materials with characteristic processing areas | . Others | ||||||||
| WC | WC00 WET-ETCHING PRETREATMENTS |
WC01 | WC03 | WC05 | WC06 | WC08 | WC10 | |||||
| . Heat treatments | . Process treatments | . Introduction of foreign substances | . . Installation methods | . Pattern printing | . Others | |||||||
| WD | WD00 WET-ETCHING METHODS |
WD01 | WD03 | WD05 | WD06 | WD07 | WD10 | |||||
| . Etching combined with light irradiation | . Etching combined with ultrasonic waves | . Multi-stage etching | . Intermittent etching | . Dual-surface etching | . Others | |||||||
| WE | WE00 WET-ETCHING LIQUIDS (I.E., PRIMARY COMPONENTS) |
WE01 | WE02 | WE03 | WE04 | WE05 | WE07 | WE08 | WE09 | |||
| . Inorganic acids and salts thereof | . . Nitric acid and nitrates | . . Sulfuric acid and sulfates | . . Phosphoric acid and phosphates | . . Chromic acid and chromates | . . Hydrofluoric acid and hydrofluorides | . . Hydrochloric acid and hydrochlorides | . . Hydrobromic acid and hydrobromates | |||||
| WE11 | WE12 | WE13 | WE14 | WE15 | WE16 | WE17 | ||||||
| . Organic acids and salts thereof | . . Acetic acid and acetates | . . Citric acid and sodium citrate | . . Oxalic acid and sodium oxalate | . . Benzoic acid and sodium benzoate | . . Picric acid and picrate | . . Sulfamic acid and salts thereof | ||||||
| WE21 | WE22 | WE23 | WE25 | WE30 | ||||||||
| . Alkali solvents | . . Caustic sodas | . . Ammonia | . Peroxides | . Others | ||||||||
| WF | WF00 WET-ETCHING LIQUIDS (I.E., ADDITIVE AGENTS) |
WF01 | WF04 | WF05 | WF06 | WF10 | ||||||
| . Liquid stabilizers | . Thickeners | . Conductive applicators | . Inhibitors | . Others | ||||||||
| WG | WG00 CONTROL OF WET-ETCHING CONDITIONS |
WG01 | WG02 | WG03 | WG04 | WG06 | WG07 | WG08 | WG10 | |||
| . Etching time | . Etching-liquid temperature | . Etching-liquid density | . . Ions | . Etching-liquid pH | . Etching-current density | . Conditions of etching-liquid injection | . Others | |||||
| WH | WH00 RECYCLING OF WET-ETCHING LIQUIDS |
WH01 | WH02 | WH03 | WH04 | WH05 | WH06 | WH07 | WH08 | WH10 | ||
| . Recycling methods | . . Chlorine gas | . . Ozone gas | . . Hydrogen peroxide | . . Anodic oxidation | . Collected substances | . . Metals | . . Salts | . Others | ||||
| WJ | WJ00 DETECTION OF WET-ETCHING END POINTS |
WJ01 | WJ03 | WJ05 | WJ10 | |||||||
| . Shape of guide holes | . Immersion time | . Microscopic examination | . Others | |||||||||
| WK | WK00 WET-ETCHING POST-TREATMENTS |
WK01 | WK02 | WK03 | WK05 | WK06 | WK07 | WK08 | WK10 | |||
| . Surface-cleaning treatments | . . Use of jigs | . . Infrared-ray irradiation | . Surface stabilization treatments | . Gilding treatments | . Resin-coating treatments | . Blowout treatments | . Others | |||||
| WL | WL00 MANAGEMENT OF WET-ETCHING LIQUIDS |
WL01 | WL03 | WL05 | WL10 | |||||||
| . Amount of corrosion current | . Oxidation-reduction potential | . Specific gravity | . Others | |||||||||
| WM | WM00 WET-ETCHING DEVICES |
WM01 | WM02 | WM03 | WM04 | WM05 | WM06 | WM07 | WM08 | WM09 | WM10 | |
| . Single tank devices | . Multi-tank devices | . Immersion devices | . Spray devices | . . Fixed nozzles | . . . Multiple nozzles | . . Swinging nozzles | . . Supply in a direction parallel to the direction of conveyance | . . Supply at right angles to the direction of conveyance | . . Jigs | |||
| WM11 | WM13 | WM14 | WM15 | WM17 | WM18 | WM19 | WM20 | |||||
| . Support means | . Agitation means | . . Gases | . . Ultrasonic waves | . Heating means and cooling means | . Conveyance means | . Chemical recycling means | . Others | |||||
| WN | WN00 WET-ETCHING USES |
WN01 | WN02 | WN03 | WN04 | WN05 | WN06 | WN07 | WN08 | WN09 | WN10 | |
| . Electronic parts | . Electrodes | . Shadow masks | . Optical parts | . Construction materials | . Mechanical parts | . Casting articles | . Grinding jigs | . Ornamental articles | . Others |