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| 3K007 | Electroluminescent light sources | |
| H05B33/00 -33/28 | ||
| H05B33/00-33/28 | AB | AB00 PURPOSE AND EFFECTS |
AB01 | AB02 | AB03 | AB04 | AB05 | AB06 | AB07 | AB08 | ||
| . Luminescence characteristics | . . Brightness | . . Efficiency | . . Color | . Electrical characteristics | . . Low-voltage operation | . . Ability to withstand high voltages | . . Short-circuit prevention | |||||
| AB11 | AB12 | AB13 | AB14 | AB15 | AB16 | AB17 | AB18 | |||||
| . Stability | . . Chemical stability | . . Measures to prevent moisture accumulation | . . Measures to prevent excessive heat | . . Adhesion between layers (i.e., prevention of peeling) | . Hysteresis or storage characteristics | . Improvement in visibility and contrast | . Ease of mounting and manufacturing, and cost reduction | |||||
| BA | BA00 SHAPES |
BA01 | BA02 | BA03 | BA04 | BA05 | BA06 | BA07 | ||||
| . Band-shaped types | . Bar-shaped types | . Braided cord-like light-emitting elements | . End-surface emission | . Multi-layered types | . Crossing-over of strip electrode groups on both sides of matrix electroluminescent (EL) layers | . Flexibility | ||||||
| BB | BB00 EXTERNAL PARTS |
BB01 | BB02 | BB03 | BB04 | BB05 | BB06 | BB07 | ||||
| . Sealing containers | . Resin molds | . Liquid seals | . Gas and vacuum seals | . Seals with dessicants and moisture-absorptive materials | . Filters, lenses, and non-reflective films | . Integration and installation of external parts on circuit boards | ||||||
| CA | CA00 SUBSTRATES |
CA01 | CA02 | CA03 | CA04 | CA05 | CA06 | |||||
| . Glass | . Ceramics | . Semi-conductors | . Metals | . Rigid resin plates | . Flexible substrates such as films | |||||||
| CB | CB00 TRANSMISION ELECTRODES |
CB01 | CB02 | CB03 | CB04 | |||||||
| . Transparent conductors | . Metallic nets and perforated metallic foils | . Extra-thin metallic foils | . Multi-layer electrodes, filter effects, and adhesion | |||||||||
| CC | CC00 TERMINALS AND ELECTRODES IN GENERAL |
CC01 | CC02 | CC03 | CC04 | CC05 | ||||||
| . Electrodes that double as reflectors | . Black electrodes | . Blasted or rough finishes | . Electrodes with slits that resemble comb teeth | . Terminal parts | ||||||||
| DA | DA00 ELECTROLUMINESCENT (EL) ELEMENTS |
DA01 | DA02 | DA03 | DA04 | DA05 | DA06 | |||||
| . Direct-current (DC) types | . Thin-film types | . Sintering types | . Dispersion types | . Three-layer types with a dielectric layer between the electroluminescent (EL) layer and the electrode | . Types with multiple electroluminescent (EL) layers | |||||||
| DB | DB00 ELECTROLUMINESCENT (EL) BASE MATERIALS |
DB01 | DB02 | DB03 | ||||||||
| . IIa-VI group (e.g., calcium sulfide [CaS] and strontium sulfide [SrS]) | . IIb-VI group (e.g., zinc sulfide [ZnS] and cadmium sulfide [CdS]) | . Carrier implantation types and light-emitting diodes | ||||||||||
| DC | DC00 ELECTOLUMINESCENT (EL) ADDITIVES |
DC01 | DC02 | DC03 | DC04 | DC05 | ||||||
| . Activators (e.g., copper [Cu], silver [Ag], gold [Au], and lead [Pb]) | . Coactivators (e.g., magnesium [Mg], managanese [Mn], aluminum [Al], and indium [In]) | . Halogens (e.g., fluorine [F], chlorine [Cl], Bromine [Br], and iodine [I]) | . Rare earths (e.g., lanthanum [La], actinoids) | . Concentration and distribution | ||||||||
| EA | EA00 INSULATORS, SEMICONDUCTORS, AND DIELECTRIC ARRANGEMENTS |
EA01 | EA02 | EA03 | EA04 | |||||||
| . Arrangement on external seals or molds | . Arrangement between electrodes and electroluminescent (EL) layers | . Admixtures with electoluminescent (EL) powders | . Heterogeneous laminations and ligh-interference films | |||||||||
| EB | EB00 ORGANIC COMPOUNDS |
EB01 | EB02 | EB03 | EB04 | EB05 | ||||||
| . Silicon (Si) and silane (H4Si) compounds | . Nitrogen (N) compounds such as nylon amino compounds | . Polyethylenes | . Cyanoethyl compounds | . Various mixtures of organic and inorganic substances | ||||||||
| EC | EC00 INORGANIC COMPOUNDS |
EC01 | EC02 | EC03 | EC04 | |||||||
| . II group (barium titanate [BaTiO3] and calcium titanate [CaTiO3]) | . III group (e.g., yttrium oxide [Y2O3], aluminum nitride [AlN], and aluminum oxide [Al2O3]) | . IV group (e.g., lead titanate [PbTiO3], hafnium monoxide [HfO], and silicon nitride [Si3N5]) | . V group (e.g., tantalum oxide [Ta2O5]) | |||||||||
| FA | FA00 MANUFACTURING METHODS |
FA01 | FA02 | FA03 | FA04 | |||||||
| . Formation of layers or films (e.g., coating, plating, and vapor deposition) | . Seals, bonds, and electrical connections | . Heat and atmospheric treatments | . Foaming methods | |||||||||
| GA | GA00 CIRCUUITS |
GA01 | GA02 | GA03 | GA04 | |||||||
| . Boosting or high-frequency generation | . Input waveforms | . Protective circuits | . Brightness control |