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F-Term-List

2H096 TREATMENT OF PHOTOSENSITIVE RESINS OR PHOTORESISTS
G03F7/00 -7/00,506;7/06;7/07;7/12-7/14;7/26-7/42
G03F7/00-7/00,506;7/06;7/07;7/12-7/14;7/26-7/42 AA AA00
PURPOSE OR USE 		AA01 AA02 AA03 AA04 AA06 AA07 AA08 AA09 AA10
. Printing plates * . . Relief printing or flexographic plates . . . Composition of plate materials . . . using liquid resins . . Lithography or offset plates . . . PS plates or pre-sensitised plates . . . . Composition of plate materials . . . Diffusion transfer lithography . . . . Composition of plate materials
AA11 AA12 AA13 AA15 AA16 AA17 AA19 AA20
. . . Water-less lithography . . . . using silicon photosensitive resins . . . . Layered products comprising photosensitive layers and silicon-rubber layers . . Intaglio plates or gravure plates . . . Resin gravure plates . . . Halftone gravure plates . . Screen plates or stencil plates . . . using metallic patterns
AA22 AA23 AA24 AA25 AA26 AA27 AA28 AA30
. Photographic images and plate-making originals . Colour proofs . Photomasks . Semiconductor elements or integrated circuits . Printed circuits or printed wiring . Electric and electronic parts . Optical parts . Others *
BA BA00
PHOTOSENSITIVE MATERIAL 		BA01 BA02 BA03 BA04 BA05 BA06 BA07 BA09 BA10
. Negative-type photosensitive resins . . Azides . . Diazos . . Acetylenic low-molecular . . Ethylenic low-molecular . . Insolubilised polymers . . Chromic acids . Positive-type photosensitive resins . . Quinonediazides
BA11 BA13 BA14 BA16 BA17 BA20
. . Solubilised polymer . Inorganic photosensitive materials . . Chalcogens . Other photosensitive materials . . Silver halides . Others *
CA CA00
FORMATION OF PHOTOSENSITIVE LAYER 		CA01 CA02 CA03 CA05 CA06 CA07 CA09
. Pretreatment of supports . . using silicon compounds . . Roughening or hydrophiling . . Subbing layers or vapour-deposition layers . . . Light absorptivity . . . Light reflectivity . . Stripping layers
CA11 CA12 CA13 CA14 CA16 CA17 CA18 CA20
. Coating methods . . Application . . . Casting application . . . Spin coating . . Laminating . . Vapour phase deposition plasma polymerisation or chemical vapour deposition or CVD methods . . Langmuir-Blodgett (LB) techniques . Others *
DA DA00
PROCESSING BEFORE IMAGE EXPOSURE 		DA01 DA02 DA03 DA04 DA10
. Baking i.e. pre-baking . Uniform exposure i.e. pre-exposure . Processing using gases . Processing using processing liquids . Others *
EA EA00
IMAGE EXPOSURE 		EA01 EA02 EA03 EA04 EA05 EA06 EA07 EA08
. Radiation sources . . Near ultraviolet light or visible light . . Far ultraviolet light . . Lasers . . . Excimer lasers . . Electron beams . . X-rays . . Ion beams
EA11 EA12 EA13 EA14 EA15 EA16 EA18 EA19 EA20
. Exposure methods . . Multiple exposures . . . Multiple exposures combining with uniform exposure i.e. secondary exposure . . . Image exposure with multiple types of radiation sources . . . Double-sided exposure . . . Exposure from the backsides . . Inclusions between exposed originals and photosensitive materials . . . Transparent sheets or gaps . . . Diffusion plates
EA21 EA23 EA27 EA30
. . . Photomechanical screens . . Drawing exposure . . Exposure atmosphere . Others *
FA FA00
PROCESSING UNDERTAKEN AFTER IMAGE EXPOSURE AND BEFORE DEVELOPMENT 		FA01 FA02 FA03 FA04 FA05 FA10
. Baking . Uniform exposure . Environment or atmosphere . Processing using gas . Processing using processing liquids . Others *
GA GA00
DEVELOPMENT 		GA01 GA02 GA03 GA04 GA05 GA06 GA08 GA09 GA10
. Liquid development . . Developing solutions . . . Organic solvent developing solutions . . . . Combinations of solvents . . . . Additives . . . . specifying physical property values * . . . Aqueous developing solutions . . . . Alkaline agents . . . . Additives
GA11 GA12 GA13 GA15 GA17 GA18 GA20
. . . . . Surfactants . . . . . Chelating agents . . . . specifying parameters of physical property values * . . . Colour formation or discolouration using developing solutions . . Rinsing or washing with water . . . Rinsing liquids . . Drying
GA21 GA22 GA23 GA24 GA25 GA26 GA27 GA29 GA30
. Liquid-development apparatus . . Immersion-type development apparatus . . . Supply of developing solution . . . Conveying sensitive materials . . . Developing tanks . . . . Injection or spraying of developing solutions . . . . Rotating brushes . . Spin development apparatus . . . Supply of developing solution
GA31 GA32 GA33 GA36 GA37 GA38 GA39 GA40
. . . Developing solution spray nozzles . . . Rotary chucks . . . Developing chambers . Dry development . . Plasma development . . . Types of plasma * . . . Means used in combination with plasma * . . . Plasma-development apparatus
GA43 GA45 GA46 GA48 GA50
. . Removal by heating . . Direct removal by exposure . . . using excimer lasers . . Powder i.e. toner development . . Stripping development
GA52 GA54 GA55 GA60
. . Colour formation by heating . . Colour formation or discolouration by transferring . . . using microcapsules . Others *
GB GB00
BAKING APPARATUS 		GB01 GB02 GB03 GB04 GB05 GB07 GB08 GB10
. Heating means . . Infrared rays . . Heaters or heating plates . . Microwaves . . Heated gases . Conveying means . . Belt conveyers . Others *
HA HA00
PROCESSING AFTER DEVELOPMENT 		HA01 HA02 HA03 HA05 HA07 HA09 HA10
. Baking post-baking or burning . Processing using processing liquids or fat desensitising . Uniform exposure i.e. post-exposure . Image correction . Image transfer . Colouring or dyeing . . Colouring or dyeing of other than resin images
HA11 HA12 HA13 HA14 HA15 HA17 HA18 HA19 HA20
. Etching . . Objects to be etched . . . Metals . . . Non-metals metal oxides or inorganic compounds . . . Polymer compounds or organic compounds . . Wet etching . . . Etching liquids . . . Wet etching apparatus . . . . Supply of etching liquids
HA21 HA23 HA24 HA25 HA27 HA28 HA30
. . . . Holding or turning objects to be etched . . Dry etching . . . Composition of the etching gas * . . . Means used in combination with etching * . Plating or vapour deposition . . Lift-off techniques . Others *
JA JA00
PROCESSING STEP 		JA01 JA02 JA03 JA04 JA06 JA07 JA08 JA10
. Combination of steps * . . Steps up to the point of image exposure * . . Steps following image exposure before development * . . Steps after development * . Inversion between or combined use of negatives and positives . . changed by exposure . . changed by development . Others *
KA KA00
MULTI-LAYER RESIST METHOD 		KA01 KA02 KA03 KA04 KA05 KA06 KA07 KA08 KA09 KA10
. Types of photosensitive layers * . . Two-layer resist films * . . . Lower layers being positives * . . . Lower layers being negatives * . . . Upper layers being negatives * . . . Upper layers being positives * . . Resist films of three or more layers * . . Intermediate films other than resists between upper and lower layers * . . Lower resist layers being exposed . . Multiple layers consisting of the same resist *
KA11 KA12 KA13 KA14 KA15 KA16 KA17 KA18 KA19
. Processing methods * . . Coating or baking . . Exposure . . Development . . . of upper resist layers . . . of lower resist layers . . Etching of resist films . . . Dry etching . . . Etching of lower layers
KA21 KA22 KA23 KA25 KA27 KA30
. . Resistance to dry etching . . Flattening uneven surfaces . . Lower layer exposure by means of upper resist layer masks . . Cross-sectional shapes or overhang shapes . . Contrast enhancement . Others *
LA LA00
AUXILIARY PROCESSING 		LA01 LA02 LA03 LA06 LA07 LA08 LA09
. Removal or stripping of used image layers . . Wet removal or stripping . . . Stripping liquids . . Dry removal or stripping . . . using plasma . . . . Types of plasma * . . . . Means used in combination with plasma *
LA11 LA12 LA13 LA16 LA17 LA18 LA19
. Removal or stripping of supports or protective layers . . Mechanical stripping or removal . . Dissolving off with processing liquids . Measurement or evaluation of characteristics * . . of photosensitive resins or photoresists . . of processing liquids . . . of developing solutions
LA21 LA22 LA25 LA30
. Preservation of photoresists . . Packaging or containers . Processing of waste-processing solutions . Others *
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