F-Term-List

G03F1/00-1/00@Z;1/88-1/90

AA00
USE OF ORIGINAL FOR PRODUCING PRINTING FORM

AA01

AA02

AA03

AA04

AA05

AA06

AA07

AA10

. Printed circuit boards

. Shadow masks

. Bar code printing

. Form printing

. Textile printing

. Multicolour printing

. Endless printing

. Other specific uses *

AB00
MEANS

AB01

AB02

AB03

AB04

AB05

AB06

AB07

AB08

. Scanners

. . Preparing input

. . Measuring magnification

. . Mounting of originals

. . Details

. . . Drums

. . . Reading

. . . Exposure

AB11

AB15

. Television or video images

. Computers

AB21

AB22

AB23

AB24

AB25

AB26

AB27

AB28

AB30

. Photographic means

. . Clean proofs or block copies

. . Film originals

. . . Handling of film originals

. . Exposure

. . Materials

. . Electrophotography

. Printing forms

. Other specific means *

AC00
OPERATION

AC01

AC02

AC03

AC04

AC05

AC07

AC08

AC09

. Pattern creation

. . Image synthesis or montages

. . Deformation enlargement or reduction

. . Moving rotating or positioning

. . Gradation

. Lay-out

. Trimming

. . Cutting out

AC11

AC13

AC15

. Dot processing or halftone processing

. Edge processing

. Other specific effects and processing *

AD00
OTHERS *

AD01

AD02

AD03

AD04

AD05

AD07

AD08

AD09

AD10

. Inspecting

. . Originals

. . . Tools

. . Page arrangement

. . Inspection of printing forms

. Correcting

. . Contrast

. . Gradation

. . Tools

AD11

AD13

. Proof-reading

. Marks

G03F1/00@Z-1/86

BA00
USE FOR SEMICONDUCTOR PRODUCTION

BA01

BA02

BA03

BA04

BA05

BA06

BA07

BA08

BA09

BA10

. Projection exposure

. Step and repeat exposure

. Proximity exposure

. Contact exposure

. Divided exposure

. Lasers

. Ultraviolet light (UV) or deep ultraviolet light (DUV)

. Ion beams electron beams or corpuscular beams

. . Photo-electron beams

. X-rays

BA11

BA12

. Printed circuit boards

. For other equipment *

BB00
PRODUCTION

BB01

BB02

BB03

BB05

BB06

BB07

BB08

BB09

BB10

. Pattern generation

. . Shape or arrangement

. . Phase shift masks

. Lithography

. . Exposure

. . . Beam exposure

. . . . Lasers

. . . . Ion beams

. . . . Electron beams

BB11

BB12

BB13

BB14

BB15

BB16

BB17

BB18

BB19

BB20

. . . . X-rays

. . . Projection exposure

. . . Contact exposure

. . Developing or etching

. . . Wet

. . . Dry

. . . . Plasma chemical vapour deposition (Plasma CVD)

. . Removing resists

. . Rinsing or washing

. . . Physical washing

BB21

BB22

BB23

BB25

BB26

BB27

BB28

BB29

BB30

. . . . Spray washing

. . . Chemical washing

. . Drying or after-treatment

. Plating vapour deposition or chemical vapour deposition (CVD)

. Lift-off

. Other means *

. Combined processes

. Holding or handling originals or masks

. Preventing contamination or removing foreign matters

BB31

BB32

BB33

BB34

BB35

BB36

BB37

BB38

. Control adjustment or detection *

. . Amount of irradiation

. . Irradiation positions

. . Positioning

. . Film thickness

. . Shape of patterns

. . Thermal expansion or stress

. . Temperature

BC00
CONSTITUENT

BC01

BC02

BC04

BC05

BC06

BC07

BC08

BC09

BC10

. Resist films

. . Multi-layer

. Light shielding films

. . Quality of materials

. . . Photosensitivity

. . . Chalcogenides

. . Methods of film formation

. . Shape or arrangement

. . Embedding

BC11

BC13

BC14

BC16

BC17

BC19

BC20

. . Multi-layer

. Anti-reflection films

. . Quality of materials

. Conductive films

. . Quality of materials

. Protective films

. . Quality of materials

BC21

BC22

BC24

BC26

BC27

BC28

BC30

. Adhesive films

. . Quality of materials

. Films for other specific effects *

. Support substrates

. . Quality of materials

. . Shape

. Frames reinforcing frames or support frames

BC31

BC32

BC33

BC34

BC35

BC36

BC37

BC38

BC39

. Pellicles

. . Films

. . . Quality of materials

. . . Manufacturing methods

. . . Surface treatment

. . Frames

. . . Quality of materials

. . . Structures

. . Mounting

BD00
INSPECTING OR CORRECTING

BD01

BD02

BD03

BD04

BD05

BD06

BD07

BD08

BD09

. Inspecting

. . Masks

. . . Pattern dimensions

. . . Pattern defects or flaws

. . . Foreign matters

. . . Overlapping precision

. . . Circuit connections or electrical design

. . Pellicles

. . Exposure optical systems

BD11

BD12

BD13

BD14

BD15

BD16

BD17

BD18

BD19

BD20

. . Inspection optical systems

. . . Light sources

. . . . Lasers

. . . . Ion beams electron beams or X-rays

. . . Light-receiving elements

. . . . Industrial television (ITV)

. . . . Charge-coupled devices (CCD) or linear sensors

. . . Microscopes or visual inspection

. . . Specific arrangement

. . . Control of optical systems

BD21

BD22

BD23

BD24

BD25

BD26

BD27

BD28

BD29

. . Enhancing inspected portions

. . . Photographic processing or transferring

. . . . Inspecting on wafers

. . Signal processing

. . . Digital processing

. . . Extracting features

. . . Comparing or distinguishing signals

. . . . Comparing with design data

. . Handling or in-line inspection of inspected items

BD31

BD32

BD33

BD34

BD35

BD36

BD37

BD38

BD39

BD40

. Correcting

. . Black defects

. . White defects

. . Lasers

. . Ion beams

. . Electron beams

. . Lift-off

. . Plating vapour deposition or chemical vapour deposition (CVD)

. . Application or coating

. . Other means *

BE00
MARK OR OTHERS *

BE01

BE02

BE03

BE04

BE05

BE06

BE07

BE08

BE09

BE10

. Marks or symbols

. . Uses

. . . Alignment

. . . Distinction

. . . Inspecting resolution

. . . Inspecting exposure precision

. . . Production process management

. . Arrangement

. . Shape or quality of materials

. . Production

BE11

BE12

. Handling or transporting masks

. . Mask holders or mask cassettes

2H095	PREPARATION OF ORIGINALS OR MASKS IN PHOTOMECHANICAL PROCESSES
	G03F1/00 -1/92@Z