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2H092 LIQUID CRYSTAL 5 (ELECTRODES AND ACTIVE MATRIXES)
G02F1/1343 -1/1345;1/135
G02F1/1343;1/1345;1/135 GA GA00
STRUCTURE OF ELECTRODE 		GA01 GA02 GA03 GA04 GA05 GA06 GA07
. Kinds . . Figure-of-eight types . . Fixed types . . Bar-graphs . . Simple matrixes . . Divided matrixes . . Multiplex matrixes
GA11 GA12 GA13 GA14 GA15 GA16 GA17 GA18 GA19 GA20
. Structures of electrodes inside display areas . . Structures of each pixel part . . . Shapes . . . . Comb-shaped electrodes . . . Size . . . Thickness . . . Layer structures . . . . Combinations with ferroelectric layers . . . White scattering electrodes . . Arrangements of pixel electrodes
GA21 GA22 GA23 GA24 GA25 GA26 GA27 GA28 GA29 GA30
. . . Positions . . . . Delta arrangements . . . Colour arrangements . . Wiring parts . . . Layer structures . . . Shapes . . Defining resistance values . . Connections of pixel electrodes and wiring electrodes . . . Through-holes . . . Positions
GA31 GA32 GA33 GA34 GA35 GA36 GA37 GA38 GA39 GA40
. Structures of electrodes outside display areas . . Lead-out electrodes to outside of cells . . . Shapes . . . Layer structures . . . . Layer structures combined with insulating layers . . Transfer electrodes . . . Plane shapes . . . Arrangements . . . Transfer structures . . External connection terminals
GA41 GA42 GA43 GA44 GA45 GA46 GA47 GA48 GA49 GA50
. . . Shapes . . . Layer structures . . . . Layer structures combined with insulating layers . . . Arrangements . . Connection structures of external circuits and external terminals . . . Connection means . . . . Conductive rubber . . . . Conductive adhesives . . . . . Heat-seal connectors . . . . Flexible wiring boards
GA51 GA52 GA53 GA54 GA55 GA56 GA57 GA58 GA59 GA60
. . . . . TAB . . . . Lead pins . . . Fixing methods . . . . Fitting . . . . Adhesion . . . . Spring pressure contact . . . Alignment or positioning . . . Sealing structures . . Integration of external circuits with liquid crystal substrates . . providing chips on liquid crystal substrates
GA61 GA62 GA63 GA64
. Structures of electrodes not directly applying signals to liquid crystals . . Touch panels . . Heater electrodes . . Antistatic or shield electrodes
HA HA00
MATERIAL OF ELECTRODE OR INSULATING FILM 		HA01 HA02 HA03 HA04 HA05 HA06 HA07
. Materials of electrodes inside display areas or insulating films excluding active electrodes . . Pixel electrodes . . . Transmission types . . . . ITO or indium tin oxide . . . Reflection types . . Wiring electrodes . . Ferroelectric layers
HA11 HA12 HA13 HA14 HA15 HA16 HA17 HA18 HA19 HA20
. Materials of electrodes outside display areas . . Lead-out electrodes to the outside of cells . . Transfer electrodes . . . Inorganic materials . . . Organic materials . . . . Matrix materials . . . . Additives . . External connection terminals . . . Inorganic materials . . . Organic materials
HA21 HA22 HA23 HA24 HA25 HA26 HA27 HA28
. . . . Matrix materials . . . . Additives . . . Materials for improving adhesion . . Connection part materials of external circuits and external connection terminals . . . Conductive adhesives . . . . Thermosetting properties . . . . Photosetting properties . . Protective film or insulating film materials
JA JA00
ACTIVE ELEMENT 		JA01 JA02 JA03 JA04 JA05 JA06 JA07 JA08 JA09 JA10
. Two-terminal elements . . Kinds . . . MIM elements . . . Varistor elements . . . Semiconductor elements . . Structures . . . Shapes . . . Size . . . . Defining element length . . . . Defining element width
JA11 JA12 JA13
. . . . Defining element thickness . . . Layer structures . . Defining characteristics
JA21 JA22 JA23 JA24 JA25 JA26 JA27 JA28 JA29 JA30
. Three-terminal elements . . Kinds . . . FET using semiconductor substrates . . . TFT (Thin film transistor) . . . . Staggered structures or top gate structures . . . . Inverted staggered structures or bottom gate structures . . Structures . . . Semiconductor layers . . . . Shapes . . . . Size
JA31 JA32 JA33 JA34 JA35 JA36 JA37 JA38 JA39 JA40
. . . . . Defining channel length . . . . . Defining channel width . . . . . Defining thickness . . . Gate insulating films . . . . Thickness . . . . Layer structures . . . Gate electrodes . . . . Shapes . . . . Thickness . . . . Layer structures
JA41 JA42 JA43 JA44 JA45 JA46 JA47 JA48 JA49
. . . Source or drain electrodes . . . . Shapes . . . . Thickness . . . . Layer structures . . . Connections between elements and pixel electrodes . . . . Through-holes . . . . Ohmic contact . . . . Metal pad layers . . Defining characteristics
JB JB00
STRUCTURE OF ELEMENT OTHER THAN ACTIVE ELEMENT OF ACTIVE SUBSTRATE 		JB01 JB02 JB03 JB04 JB05 JB06 JB07 JB08 JB09
. Pixel parts . . Arrangements . . . Delta arrangements . . Arrangements . . Shapes . . Size . . Reflection types . . . White scattering . . Combinations with ferroelectric layers
JB11 JB12 JB13 JB14 JB16
. Counter electrodes . . for two-terminal elements . . for three-terminal elements . . . Division . . . Layer structures
JB21 JB22 JB23 JB24 JB25 JB26 JB27
. Wiring parts . . Scanning wiring . . . Shapes . . . Layer structures . . . Size . . . . Defining wiring width . . . . Defining thickness
JB31 JB32 JB33 JB34 JB35 JB36 JB37 JB38
. . Signal wiring . . . Shapes . . . Layer structures . . . Size . . . . Defining wiring width . . . . Defining thickness . . making source electrodes common electrodes . . Insulation of intersection parts
JB41 JB42 JB43 JB44 JB45 JB46
. Arrangements of elements . . Multiple active elements for one pixel electrode . . . Multiple active elements different from each other . . . . of different polarities . . Multiple pixel electrodes for one active element . . Grouping of elements
JB51 JB52 JB53 JB54 JB56 JB57 JB58
. Light shielding layers . . combined with black matrices . . Defining potentials . . Light shielding by electrodes . Insulating layers . . Passivation layers . . Flattened layers
JB61 JB62 JB63 JB64 JB65 JB66 JB67 JB68 JB69
. Capacitive elements . . Positions . . . Element parts . . . Wiring parts . . . Counter parts . . Layer structures . . Connections of capacitive elements . . . Connections with wiring . . . providing wiring for capacitive elements
JB71 JB72 JB73 JB74 JB75 JB77 JB79
. Repairing structures . . Elements . . Wiring parts . . Outside a display area . . Inter-pixel connections . Structures for inspections . having structures for measures against static electricity
KA KA00
MATERIAL OF ACTIVE ELEMENT OR PHOTOCONDUCTOR LAYER 		KA01 KA02 KA03 KA04 KA05 KA06 KA07 KA08 KA09 KA10
. Element materials . . Crystal conditions . . . Single crystals . . . Polycrystalline . . . amorphous . . Substances . . . Inorganic materials . . . . Compounds . . . Organic materials . . . Doping
KA11 KA12 KA13 KA15 KA16 KA17 KA18 KA19 KA20
. Gate insulating layers . . Inorganic materials . . Organic materials . Electrode materials . . Crystal conditions . . Substances . . . Inorganic materials . . . . Compounds . . . Organic materials
KA21 KA22 KA23 KA24
. Insulating layers for capacitive elements . . Inorganic materials . . Organic materials . Ohmic contact layers
KB KB00
MATERIAL OTHER THAN ACTIVE ELEMENT OF ACTIVE SUBSTRATE 		KB01 KB02 KB03 KB04 KB05 KB06
. Wiring electrode materials . . Crystal conditions . . Substances . . . Inorganic materials . . . . Compounds . . . Organic materials
KB11 KB12 KB13 KB14 KB15
. Pixel electrode capacitive element electrode or counter electrode materials . . Crystal conditions . . Substances . . . Compounds . . . Organic materials
KB21 KB22 KB23 KB24 KB25 KB26 KB28
. Non-conductive layer materials . . Flattening layers . . Alignment layers . . Passivation layers . . Interlayer insulating layers . . Colour filter layers . Ferroelectric layers
LA LA00
USE OF PHOTOCONDUCTIVE LAYER 		LA01 LA02 LA03 LA04 LA05 LA06 LA07 LA08 LA09
. Element structures . . Layer structures . . Planar surface structures . Structures other than elements . . Electrodes . . Reflection films . . Substrates . . Optical systems for read . . . RGB (red green and blue)
LA11 LA12 LA13 LA14 LA15 LA16
. Driving methods . . Write light . . . Wavelength characteristics . . Electrical . . . Driving waveforms . . Light-voltage characteristics
MA MA00
MANUFACTURING METHOD 		MA01 MA02 MA03 MA04 MA05 MA06 MA07 MA08 MA09 MA10
. Manufacturing methods or processes . . Film formation methods . . . PVD . . . . Vapour deposition . . . . Sputter method . . . . Ion plating method . . . CVD . . . . Plasma . . . . Light . . . Coating
MA11 MA12 MA13 MA14 MA15 MA16 MA17 MA18 MA19 MA20
. . . Plating . . Pattern formation . . . Photolithography . . . . Photomasks . . . . Photoresists . . . . Exposure method . . . Etching . . . . Chemical etching . . . . Physical etching . . . . Etching masks
MA21 MA22 MA23 MA24 MA25 MA26 MA27 MA28 MA29 MA30
. . . Vapour deposition using masks . . Treatment methods . . . Oxidation treatments . . . . Anodic oxidation . . . . Thermal oxidation . . . Thermal diffusion . . . Doping . . . Crystallisation . . . . Heating . . . . Lasers
MA31 MA32 MA33 MA34 MA35 MA37
. . Adhesion . . . Thermo-compression . . . Ultrasonic adhesion . . . Soldering . Devices . Sequences of processes
MA41 MA42 MA43 MA46 MA47 MA48 MA49 MA50
. Self-alignment . . Back surface exposure . Batch formation . Repairing methods . . Cutting . . . Etching . . . mechanical . . . electrochemical
MA51 MA52 MA55 MA56 MA57 MA58 MA59
. . . electrical . . Connections . Inspection methods . . electrical . . . Probing . . . Driving waveforms . . . electrochemical
NA NA00
PURPOSE 		NA01 NA02 NA03 NA04 NA05 NA06 NA07
. Display characteristic improvement . . Prevention of electrodes from being visible . . Interference colour prevention . . Orientation disturbance prevention . . Response speed improvement . . Stereoscopic effect imparting . . Improvement of aperture ratio
NA11 NA12 NA13 NA14 NA15 NA16 NA17 NA18 NA19
. Stabilisation . . Redundant configuration . . Element defect reduction . . Electrostatic breakdown prevention . . Disconnection prevention . . Short-circuit prevention . . Protection . . Adhesion improvement . . Flattening
NA21 NA22 NA23 NA24 NA25 NA26 NA27 NA28 NA29 NA30
. Improvement of element performances . . Improvement of ON/OFF ratio . . Reduction of parasitic capacitance . . Uniformisation of element performances . Others . . Power saving . . Simplification of manufacturing methods . . Reduction of electrode resistance . . Yield improvement . . Maintenance safety keeping or inspection
PA PA00
ASSOCIATION WITH OTHER COMPONENTS 		PA01 PA02 PA03 PA04 PA05 PA06 PA07 PA08 PA09 PA10
. Substrates . Alignment layers . Spacers . Injection ports and sealing members. . Cell fixing means . Driving circuits driving methods or power sources . Optical elements . . Wavelength selecting elements e.g. colour filters . . Light-shielding or light-absorbing members . . Phase compensation plates
PA11 PA12 PA13
. . Polarising elements . . Diffusing elements or reflecting elements . . Light sources
QA QA00
PRINCIPLE OF OPERATION OF LIQUID CRYSTAL 		QA01 QA02 QA05 QA06 QA07 QA08 QA09 QA10
. Current effect types . . Dynamic scattering (DS) types . Field effect types . . Dielectric anisotropy types . . . Twisted nematic ( TN ) types . . . Dichroic pleochroic and guest-host (GH) types . . . Electrically controlled birefringence (ECB) types . . . Super twisted birefringence (SBE or STN) types
QA11 QA12 QA13 QA14 QA15 QA16 QA17 QA18 QA19 QA20
. . . Phase change (PC) types . . Permanent dipole types . . . Ferroelectric types . . . Anti-ferroelectric types . . Polymer dispersion types . Thermal effect types . Optical effect types . Other principles of operations . . Pressure effect types . . Magnetic field effect types
RA RA00
SPECIAL USE 		RA01 RA02 RA03 RA04 RA05 RA06 RA10
. Spectacles for stereoscopic TV . Antiglare mirrors . Liquid crystal lenses . Printer heads . Projectors . Optical computing units . Others
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