F-Term-List

G02F1/133-1/133,500;1/133,540;1/1333;1/1334;1/1339-1/1341;1/1347

HA00
GENERAL STRUCTURES

HA01

HA02

HA03

HA04

HA06

HA07

HA08

HA09

HA10

. Structure of the liquid-crystal layers

. . Polymer liquid crystals

. . Dispersed liquid crystals

. . . Polymer dispersed liquid crystals ( PDLC )

. . . Microencapsulated liquid crystals

. . Cell thickness changes according to location

. . Members except liquid crystal between a pair of substrates

. . . Addition of chemical substances

. . . Dividing members

HA11

HA14

HA15

HA16

HA17

HA18

HA19

. . . Fixed indication (e.g., transparent print panels)

. Structures on substrates

. . Inside cells

. . . Impedance elements

. . Outside cells

. . . Conductive films (e.g., touch panels)

. . . Heating bodies

HA21

HA22

HA23

HA24

HA25

HA26

HA27

HA28

HA29

HA30

. Cell-lamination structure

. . Lamination wherein liquid-crystal modes differ

. . Guest-host (GH) cell lamination

. . Adjustment of retardation (greek capital letter delta n.d)

. . . Optical compensation

. . Negative and positive inversion

. . Positioning of pixels and indication components

. . Arrangement of color-selecting polarizers and color filters

. . Orientation of cells in the cell-lamination structure

. . Twist angles of cells in the cell-lamination structure

HA31

HA32

HA33

HA35

HA36

HA37

HA38

HA39

HA40

. . Multiple displays

. . Three or more layers

. Identical arrangements of multiple cells on a flat surface

. Structures based on special addressing methods

. . Plasma-addressing methods ( PALC )

. . Electron-beam addressing methods

. . Light addressing methods

. . Heat addressing methods (i.e., except laser beams)

. Outer frame and supporting structures

JA00
MATERIALS OF GENERAL STRUCTURES

JA01

JA02

JA03

JA04

JA05

JA06

JA07

JA08

JA09

JA10

. Materials for polymer liquid-crystal layers

. Materials for liquid crystal layers (i.e., excluding liquid crystals per se)

. . Supporting base materials for dispersed liquid crystals

. . . Supporting base material is polymer

. . Additives (i.e., not including general pigments)

. . . Light- and heat-absorbing materials

. Materials for member on substrate

. . Conductive films

. . Heating bodies

. Outer frames and structural support members

JA11

. Other structural materials

KA00
METHODS OF GENERAL STRUCTURES

KA01

KA02

KA03

KA04

KA05

KA06

KA07

KA08

KA09

KA10

. Manufacturing Methods of liquid crystal cells

. . Polymer liquid crystals

. . Dispersed liquid crystals

. . . Polymer dispersed liquid crystals ( PDLC )

. . . . Liquid-crystal impregnation

. . . . Emulsification and production of turbidity

. . . . Phase separation

. . . . . Use of light polymerization

. . . Microencapsulated liquid crystals

. . Extraction and manufacturing methods for multiple cells

KA11

KA12

KA13

KA15

KA16

KA17

KA19

KA20

. . Manufacturing methods for cells with special structures

. . . Reaming of indication components

. . . Curved cells

. Manufacturing methods for indication components

. . Connections between panels

. . Connections to external circuits

. Operating methods

. . Operation of laminated cells

LA00
STRUCTURES OF SPACERS, FILLING HOLES, AND SEALS

LA01

LA02

LA03

LA04

LA05

LA06

LA07

LA08

LA09

LA10

. Spacer structures

. . Cross Sectional structures

. . . Coated spacers (i.e. double-layer spacers)

. . . Use of uneven surfaces and protuberances of the substrate as spacers

. . . Insertion of spacers with different external diameters

. . Spacer shapes

. . . Bead-like and spherical shapes

. . . Fibrous and fiber-like forms

. . . Columnar, porous, latticed, belt-like, and cylindrical shapes

. . . Spacers with specific shapes

LA11

LA12

LA13

LA14

LA15

LA16

LA17

LA18

LA19

LA20

. . Combined use with other functional members

. . Arrangement and placement of spacers

. . . Placement with relation to seals

. . . . Distribution on the inner surface of the seal

. . . . Distribution inside seals

. . . Placement in non-indicating members

. . . Distribution inside alignment films

. . . Placement with relation to filling holes

. . Prescribed sizes and granular dimensions

. . Prescribed density and interval values

LA21

LA22

LA24

LA25

LA26

LA27

LA28

LA29

LA30

. Filling-hole structure

. . Filling-hole placement

. . Closing of filling holes

. . . Closing of tubes

. . . Screw stops and interfitting of stop members

. . . Double blocks

. . Shapes of filling holes

. . . Weirs

. . . Long-draw intakes (e.g., two-layered types)

LA31

LA32

LA33

LA35

. . . Projecting shapes

. . . Machining of substrate

. . . Multiple filling holes in each cell

. . Prescribed values relating to filling holes

LA41

LA42

LA43

LA44

LA45

LA46

LA47

LA48

LA49

. Seal structure

. . Multi-layer seals

. . . Sealing of graduated and inclined sections on the substrate

. . Use of bumps on the substrate as part of the seal

. . Deformation of the substrate ends for sealing

. . Treatment of adhesive components of the seal

. . . Groove structure and surface roughening

. . . Formation of insulation, connection, and metal layers

. . Prescribed values relating to seals

MA00
MATERIALS FOR SPACERS, FILLING HOLES, AND SEALS *ADDITIVE CODE IS NECESSARY. SPACERS : .X SEALS : . YFILLING HOLES : .Z

MA01

MA03

MA04

MA05

MA06

MA07

. Inorganic materials

. Organic materials

. . Base compounds

. . Additives (i.e., including inorganic materials)

. . . Conductive materials (i.e., including inorganic materials)

. . . Ultraviolet-absorbing (UV) materials (including inorganic materials)

MA11

MA12

MA13

MA15

MA16

. Metals

. . Copper soldering

. . Films formed by vapor deposition

. Materials for treating the backing layers

. . Surfactants

NA00
FORMING OF SPACERS, FILLING HOLES, AND LIQUID CRYSTAL LAYERS AND BONDING A PAIR OF SUBSTRATES

NA01

NA02

NA03

NA04

NA05

NA06

NA07

NA08

NA09

NA10

. Spacer-forming processes

. . Vapor deposition

. . Soaking and removal

. . . Electro-deposition

. . Coating

. . . Inclusion of spacers in the coating materials

. . . Printing

. . . . Screen printing

. . . Distribution and spraying

. . . . Dry processes

NA11

NA12

NA13

NA14

NA15

NA17

NA19

. . . . Electro-charging

. . Means for pattern formation (i.e., specification of forming limits)

. . . Masks and screens

. . . Photolithography

. . Prevention of movement of the spacing members

. . Manufacturing of the spacing members

. Formation processes for filling holes

NA21

NA22

NA24

NA25

NA26

NA27

NA28

NA29

NA30

. Formation processes for liquid-crystal layers

. . Formation of liquid crystals bofore bonding a pair of substrates

. . Pouring of liquid crystals after bonding a pair of substrates

. . . Pouring using a vacuuming and decompression

. . . . Variants with exhaust openings

. . Backing-layer treatments and processes

. . . Groove formation

. . Relation with direction of orientation treatment

. . Formation of smectic liquid crystal layers (e.g.,ferroelectric liquid crystals)

NA31

NA32

NA33

NA34

NA35

NA37

NA38

NA39

NA40

. . Temperature adjustment and heating

. . Formation of liquid crystals layers during pressurization of the cell

. . Micro-adjustment and monitoring of liquid crystals layers and cell thickness

. . Pre-treatment of the liquid crystal layers (e.g., defoaming of liquid crystals)

. . Post-treatment (i.e., for even surface treatments)

. Processes of sealing and bonding a pair of substrates

. . Positioning

. . Coating of sealing materials

. . . Printing methods

NA41

NA42

NA43

NA44

NA45

NA46

NA47

NA48

NA49

NA50

. . . . Screen printing

. . . Dispensers (e.g., nozzles and sprays)

. . Sealing means (i.e., including closing filling holes and bonding a pair of substrates)

. . . Ultra-violet (UV) irradiation

. . . Heating

. . . Fusion by ultrasonic waves

. . . High-frequency wave induction

. . . Pressurization

. . . . Sealing and bonding a pair of substrates in a vacuum

. . . Defoaming and removal of air from the sealing materials

NA51

NA52

NA53

NA55

NA56

NA58

NA60

. . . Temporary seals

. . . Blowing-in and solidifying of liquid sealing materials

. . Sequence with other processes

. Bundled treatment of multiple cells

. Continuous processing

. Use of resin substrates

. Devices and tools

PA00
FUNCTIONS AND CHARACTERISTICS OF SPACERS, FILLING HOLES, AND SEALS

PA01

PA02

PA03

PA04

PA05

PA06

PA07

PA08

PA09

. Functions and characteristics of spacers

. . Fixed indication and color

. . Electrical functions and characteristics

. . . Provision of conductivity for common transformation

. . Optical functions and characteristics

. . Hardness and elasticity ratios

. . Heat-resistance or thermal expansion

. . Orientation functions

. . Surface characteristics (e.g., adhesion characteristics and wetting characteristics)

PA11

PA12

PA13

PA15

PA16

PA17

PA18

PA19

. Functions and characteristics of Filling holes

. . Prevention of dust intrusion

. . Use of adhesives to reinforce closing filling hole

. Functions and characteristics of sealing materials

. . Fusion resistance of liquid crystals

. . External connections and electrode transfer

. . Color

. . Improvement of compatibility with the substrate

QA00
PURPOSES AND EFFECTS

QA01

QA02

QA03

QA04

QA05

QA06

QA07

QA08

QA09

QA10

. Security

. . Mechanical protection

. . . Prevention of shaking and impact

. . . Prevention of bending

. . Measures to protect against harmful and stray light

. . Measures against high and low temperatures

. . Water- and moisture-proofing

. . Dustproofing

. . Simplification of maintenance and exchange of parts

. . Electromagnetic shielding and prevention of electrically charging

QA11

QA12

QA13

QA14

QA15

QA16

. Reduction of thickness, size, and weight

. Productivity improvement

. Reduction of material consumption and the number of parts

. Assurance of uniform cell thickness

. Assurance of uniform orientation

. Other purposes and effects

RA00
PRINCIPLE OF OPERATION OF LIQUID CRYSTAL

RA01

RA02

RA03

RA04

RA05

RA06

RA07

RA08

RA09

RA10

. Electric-current effect types

. . Dynamic-scattering ( DS ) types

. Electric-field effect types

. . Dielectric anisotropy types

. . . Twisted-nematic ( TN ) types

. . . Dichroic, pleochroic, and guest hosting ( GH ) types

. . . Electrically controlled birefringence types[ECB]

. . . . Homeotropic types (e.g., deformation of aligned phase types [DAP], vertically aligned nematic types [VAN])

. . . . Homogeneous types

. . . Super twisted types (e.g., super twisted nematic types [STN], super-birefringent effect types [SBE])

RA11

RA12

RA13

RA14

RA15

RA16

RA17

RA18

RA19

RA20

. . . Phase change ( PC ) types

. . Permanent dipole types

. . . Ferroelectric types( FLC )

. . . Antiferroelectric types( AFLC )

. Thermal effect types

. . Changes of Liquid crystal phase and phase transitions

. Optical effect types

. Other principles of operation

. . Pressure effect types (e.g., vibration)

. . Magnetic-field effect types

SA00
PARAMETERS AND VALUES RELATING TO CELL CONDITIONS

SA01

SA02

SA03

SA04

SA05

SA06

SA07

SA08

SA09

SA10

. Cell thickness ( d )

. Refraction index and retardation

. . Refraction-index anisotropy ( delta(n) )

. . Retardation ( delta(n) * d )

. Ligth transmission of liquid-crystal materials

. Elastic constants of liquid-crystal materials

. Twist angles

. Regulated pitch ( p ) (i.e., after cell filling), and depth versus pitch ( d/p )

. Spontaneous pitch ( q ) of the liquid-crystal material, and depth versus pitch ( d/q )

. Pre-tilted angles

SA11

SA12

SA13

SA14

SA15

SA16

SA17

SA18

SA19

SA20

. . Different angles on the upper and lower substrates

. Angles formed between polarized light axes and orientation axes

. Angles formed between polarized light axes of polarization plates

. Operational temperature

. Drive frequency

. Dielectric constant and dielectric anisotropy of the liquid crystal materials

. Parameters and values of other cells

. Parameter interrelationships

. . Ratios and differences

. . Powers (i.e., except 1) and square roots of a number

TA00
ASSOCIATION WITH OTHER CONSTITUENT ELEMENTS

TA01

TA02

TA03

TA04

TA05

TA06

TA07

TA08

TA09

TA10

. Substrates

. Conductive bodies and electrodes

. . Externally connected electrodes

. Alignment films

. Insulating films

. Adhesive agents

. Driving circuits and driving elements

. . Power supplies

. . Active elements, nonlinear elements (e.g., thin-film transistors [TFT] and metal-insulator-metal diodes [MIM])

. . Photoconductors

TA11

TA12

TA13

TA14

TA15

TA16

TA17

TA18

TA19

TA20

. Optical elements

. . Wavelength-selecting elements (e.g., color filters)

. . Light-shielding and light absorbing members

. . Phase-compensating plates

. . Polarization elements

. . Lenses

. . Scattering elements and reflecting elements

. . Light sources

. . . Light sources for writing

. . Light-guides and light fibers

UA00
SPECIAL USES

UA01

UA03

UA05

UA07

UA09

. Anti-glare mirrors

. Light bulbs

. Projectors

. Level meters

. Other special uses

2H089	Liquid Crystal 2 (General structure, spacers, filling holes, and closing members)
	G02F1/133 -1/133,500;1/133,540;1/1333;1/1334;1/1339-1/1341;1/1347