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F-Term-List

2C065 THERMAL PRINTER STRUCTURES
B41J2/315 -2/345@Z;2/42-2/425,101@Z;2/475-2/48
B41J2/32@B;2/32@C;2/32@J;2/32@Z;2/325@A;2/325@C;2/325@F;2/325@Z;2/33;2/425,101@A-2/425,101@Z;2/475@Z AA AA00
SCANNING TYPE 		AA01 AA02 AA03 AA04 AA05 AA06 AA07 AA08
. Line types . Serial types . . Bidirectional recording . Shuttle types . Character or plate types . . Segment types . Matrix types . Pen types excluding those covered by 108C
AB AB00
COLOUR FORMING TYPE 		AB01 AB02 AB03 AB04 AB05 AB06 AB07 AB08 AB09 AB10
. Heat sensitive paper types . Ink transfer types . . Ink ribbons excluding those covered by 117A . . Ink belts . . Ink rollers excluding those covered by 117B . . . Ink-integrated rollers . . having ink-holding holes . . recording paper per se being ink carriers . . Intermediate transfer bodies . . Sublimation-type ink
AB11
. . using toner i.e. powder
AC AC00
RECORDING PURPOSE 		AC01 AC02 AC03 AC04
. Colour recording excluding those covered by 117C . Shade recording . equalising shades . Others (purposes)
AD AD00
USE 		AD01 AD02 AD03 AD04 AD05 AD06 AD07
. Ticket vending machines . Label printers . Hand-held printers . Measuring devices recorders or plotting machines . Copying machines . Facsimile machines . Others (use)
AE AE00
RECORDING METHOD OR DEVICE 		AE01 AE02 AE03 AE04 AE05 AE06 AE07 AE08
. Use of light excluding those covered by 109A . Use of magnetic forces . Use of electric fields . Current-carrying types excluding those covered by 109B or 117F . Ink-jet types . with preheating excluding those covered by 109J . having fixing means excluding those covered by 109J . having cooling means excluding those covered by 109C or 109Z
AF AF00
MEDIUM PER SE * 		AF01 AF02 AF03
. Recording media * . Transfer media * . recording media and transfer media being integrated *
B41J2/425,101@A;2/425,101@C;2/425,101@Z BA BA00
DISCHARGE BREAKDOWN TYPE, EXCLUDING DRIVING 		BA01 BA02 BA03 BA04 BA05 BA06 BA07 BA08 BA09 BA10
. Structures or manufacturing methods of heads * . . Electrodes or holders * . . . Electrodes per se * . . . Drum types . . . Flexible substrates . . . Layered types . . . Stacked types . . . Embedded types . . . Manufacturing methods * . . Supports *
BA11 BA12 BA13 BA14 BA15 BA16 BA17 BA18 BA19
. . . Detachable mechanisms * . . . Belt scanning or rotating scanning * . . Structures of conductors * . . Return electrodes * . Others (purposes) * . . Recording methods or devices * . . . Electrolytic types . . Handling of recording media * . . Driving control *
B41J2/425,101@B BB BB00
DISCHARGE BREAKDOWN TYPE (DRIVING) 		BB01 BB02 BB03
. Driving or control (purposes) * . . Control of driving energy (purposes) * . . Time division driving (purposes) *
B41J2/475@Z CA CA00
OPTICAL-THERMAL TYPE 		CA01 CA02 CA03 CA04 CA05 CA06 CA07 CA08 CA09 CA10
. Irradiation devices * . . Radiation and generating devices thereof * . . . Lasers * . . . Infra-red rays * . . Control devices * . Heating methods * . . Direct heating types . . . having light-heat converters . . Photoelectric types . Recording methods or means *
CA11 CA12 CA13
. . Combined use types with heating means . . Surface-stripping types . Others (purposes) *
B41J2/32@B;2/325@F CB CB00
CONDUCTING TYPE 		CB01 CB02 CB03 CB04 CB05 CB06 CB07 CB08 CB09 CB10
. Structures or manufacturing methods of electrodes * . . Recording electrode heads * . . . Pin-shaped electrodes . . . . Holding structures of electrodes * . . . other than pin-shaped electrodes . . . . Drum types . . . being layered . . . . Disposition at the centre of planes . . . Special dot disposition . . Return electrodes *
CB11 CB12 CB13 CB14 CB15 CB16 CB17 CB18 CB19
. . Electrodes integrated with recording and return types . . Supporting structures of electrode heads * . ribbon-related * . Recording methods or devices * . . Conductive heating sheets . . Disposition of return electrodes on the opposite side of recording electrodes . Driving or control (purposes) * . . Driving energy control (purposes) * . Others (purposes) *
B41J2/32@C CC CC00
MECHANISM FOR HOLDING OR ACTUATING HEAD 		CC01 CC02 CC03 CC04 CC05 CC06 CC07 CC08 CC09 CC10
. head-related * . . Substrates or heads per se or structures of supporting or mounting thereof * . . . detachable . . undetachable . . Attachment or detachment . . . Means . . . . manually operated . . . . Magnets . . . . Cams . . . Head units
CC11 CC12 CC13 CC14 CC15 CC16 CC17 CC18 CC19 CC20
. . . Selection between two rows of heads . . Pressure switching with driving sources . . Adjustment without driving sources . . . Automatic adjustment . . . Manual adjustment . . . Parallel degrees or alignment inside head surfaces . . . Pressure adjustment of entire heads . . . Equalisation of head pressure . . . Platen adjustment . . Head feeding *
CC21 CC22 CC23 CC24 CC25 CC26 CC27 CC28 CC29 CC30
. . . Head return * . . Driving of head elements * . recorded medium-related * . . Paper-feeding operations * . . Platens * . . . Platens per se * . . . Attachment or detachment of platens * . . Detachable rollers * . . Pressers * . . Guides *
CC31 CC32 CC33
. . Pressers or guides mounted on heads * . Other mechanisms operations or control (purposes) * . . Interlocking relationship to others *
B41J2/32@J CJ CJ00
PRE-TREATMENT OR AFTER-TREATMENT 		CJ01 CJ02 CJ03 CJ04 CJ05 CJ06 CJ07 CJ08 CJ09
. Pre-treatment . After-treatment . being treated by heat . . Recording by light . Treatment by light . Application of materials for recording . by pressure . Coatings . Others (purpose) *
B41J2/32@Z CZ CZ00
OTHER STRUCTURE OR CONTROL 		CZ01 CZ02 CZ03 CZ04 CZ05 CZ06 CZ07 CZ08 CZ09 CZ10
. Recording control (circuits) (purposes) * . . Recorded data processing (purposes) * . . Driving energy control (purposes) * . . . Driving timing (purposes) * . Handling of paper * . . Paper feeding * . . . Speed control * . . Platens per se * . . Cutting * . head-related *
CZ11 CZ12 CZ13 CZ14 CZ15 CZ16 CZ17 CZ18
. . Head feeding * . . Head attachment or detachment * . Recording methods or devices * . Others (purposes) * . . Cooling or heat discharge * . . Cleaning (F-term) * . . Detectors (objects to be detected) * . . Processing during abnormal conditions (abnormal conditions) *
B41J2/325@A DA DA00
HEAT SENSITIVE TRANSFER TYPE 		DA01 DA02 DA03 DA04 DA05 DA06 DA07 DA08 DA09 DA10
. head-related * . . Head operations * . . . Head attachment or detachment * . . . . Head units . . . Feeding in a forward direction * . . . Feeding in a return direction * . . Structures of heads * . . Driving of head elements * . . . Recorded data processing * . ribbon-related *
DA11 DA12 DA13 DA14 DA15 DA16 DA17 DA18 DA19 DA20
. . Detectors * . . Forward feeding or winding * . . Reverse feeding * . . Up-and-down shift * . . Rollers * . . Cassettes and mounting or replacement thereof * . . designed for economy . . Forward and reverse recording . . Deletion of residual information or reproduction * . . Prevention of tension bias wrinkling or vibration *
DA21 DA22 DA23 DA24 DA25 DA26 DA27 DA28 DA29 DA30
. . usable a plurality of times . . Other mechanisms operations or control * . paper feed-related * . . Detectors * . . Operations * . . . Paper-feeding operations * . . . opening or closing platen units . . Mechanisms * . . . Mechanisms around platens * . Stripping *
DA31 DA32 DA33 DA34 DA35 DA36 DA37 DA38
. . Operations * . . Mechanisms * . Recording methods or devices * . . also recording on heat sensitive paper * . . Ink jets * . Other mechanisms operations or control (purposes) * . . Interlocking relationship to others * . . Detectors (objects to be detected) *
B41J2/325@C DC DC00
COLOUR RECORDING 		DC01 DC02 DC03 DC04 DC05 DC06 DC07 DC08 DC09 DC10
. head-related * . . Recording control (purposes) * . . . Driving energy control (purposes) . . A plurality of heads . ribbon-related * . . Kinds of ribbons * . . . Series-type ribbons (a free word combined with F-term: Meandering types) . . . Parallel-type ribbons . . . without multicolour printing . . . A plurality of single-colour ribbons
DC11 DC12 DC13 DC14 DC15 DC16 DC17 DC18 DC19 DC20
. . . Ribbons of colour layers stacking types or multi-colour layers including types . . . Multiple use type ribbons . . Control * . . . Control for saving ribbons . . Mechanisms * . . . Inclined line feed . . . Shift mechanisms . . Detectors . paper-related * . . Kinds of paper *
DC21 DC22 DC23 DC24 DC25 DC26 DC27 DC28 DC29 DC30
. . . sheet-like . . . . Winding types or recirculation types . . . Continuous paper . . . Colour layers stacking types or multi-colour layers including types . . Control * . . . Reciprocating transfer . . Mechanisms * . . . around platens * . Recording methods or devices * . . Types using both transfer types and heat sensitive colouring types
DC31 DC32 DC33
. . Structures for not recording unwanted colours . Others * . . Processing of seams or borders
B41J2/325@Z DZ DZ00
OTHER TRANSFER TYPE 		DZ01 DZ02 DZ03 DZ04 DZ05 DZ06 DZ07 DZ08 DZ09 DZ10
. Ink storage and supply devices * . . Tanks having openings on recording parts . . . having openings for discharging selected ink . . Ink platens . . Ink storage mechanisms * . . Ink supply or regenerating mechanisms * . . . Ink smoothing * . . Ink carriers * . Recording methods or devices * . Driving or control (purposes) *
DZ11 DZ12
. . Control of driving energy (purposes) * . Others (purposes) *
B41J2/335;2/335,101@A-2/335,101@Z;2/345@A-2/345@Z GA GA00
ARRANGEMENT OF HEATING ELEMENT 		GA01 GA02 GA03 GA04 GA05 GA06 GA07
. Line types . Serial types . Matrix types . Shuttle types . Character or plate types . . Segment types . Pen types
GB GB00
DISPOSITION OF HEATING ELEMENT 		GB01 GB02 GB03 GB04 GB05
. Disposition on end surfaces on flat plate surfaces . Continuous resistors excluding those covered by 113D . Disposition on flat plate end surfaces . Disposition on curved surfaces . . Disposition on entire cylindrical surfaces
GC GC00
PURPOSE OF STRUCTURE OF THERMAL HEAD 		GC01 GC02 GC03 GC04 GC05
. Shading recording . Uniformity of density or dot diameters . . Seams . . Centre and ends . Prevention of dot gaps or white streaks
B41J2/335;2/335,101@A;2/335,101@B;2/335,101@Z HA HA00
THERMAL HEAD 		HA01 HA02 HA03 HA04 HA05 HA06 HA07 HA08 HA09 HA10
. Structures of heating elements * . . Linear heating elements . . Plate-like heating elements excluding layered films . . being heated . . forming convex heating parts . . Two-layered resistive layers . . Three- or more layered resistive layers . Heater substrates or bases * . Substrates or bases for mounting or supporting * . Heat dischargers *
HA11 HA12 HA13 HA14 HA15 HA16 HA17 HA18 HA19 HA20
. Structures or treatment of mounting connection or adhesion * . . Borders * . . detachable . . Prevention of warping flattening or equalisation of pressure * . . Adjustment of parallelism or positioning . Structures of conductors * . . Diodes driving structures or the like . . Embedded types . . Connections * . . . using cables *
HA21 HA22 HA23 HA24 HA25 HA26 HA27 HA28 HA29
. . . Multilayer wiring . Temperature control * . . Temperature sensors . . Cooling means * . . . Peltier devices . Others (purposes) * . . Paper guides or pressers * . . Protective mechanisms * . . Special uses (uses)
B41J2/335,101@A JA JA00
RESISTOR MATERIAL 		JA01 JA02 JA03 JA04 JA05 JA06 JA07 JA08 JA09 JA10
. Materials . . Combinations of two elements . . Combinations of three elements . . One element or combinations of four or more elements . . Cermets . . Tantalum . . Chromium . . Nickel . . Boron . . Carbon
JA11 JA12 JA13 JA14 JA15 JA16 JA17 JA18 JA19
. . Nitrogen . . Oxygen . . Silicon . . Platinum-group elements e.g. ruthenium . . Others [materials] . Manufacturing methods . . Formation of thick films . . Adjustment or stabilisation of resistance values . Others (purpose) *
B41J2/335,101@C JC JC00
SUBSTRATE OR GLAZE LAYER 		JC01 JC02 JC03 JC04 JC05 JC06 JC07 JC08 JC09 JC10
. Structures of substrates * . . Partial protrusions . . Recesses or notched parts on resistor sides . . Recesses or notched parts on heat discharging sides . . Recording from substrate sides . Substrate materials or manufacturing methods [materials] [manufacturing methods] . . Conductors . Structures of glaze layers * . . Entire glaze layers other than plane layers . . Partial glaze layers
JC11 JC12 JC13 JC14
. . Two or more glaze layers . Glaze layer materials or manufacturing methods [materials] [manufacturing methods] * . Others (purposes) * . . Special layers on or under glaze layers or substrates (purposes)
B41J2/335,101@D;2/335,101@J JD JD00
INTERMEDIATE LAYER 		JD01 JD02 JD03 JD04 JD05 JD06 JD07 JD08 JD09 JD10
. Structures * . . Convex layers . . . Wear-resistant layers or protective layers . . . Resistors . . . Glaze layers . . . Substrates . . Positions of other convex layers or intermediate layers . . . Upper layers of resistors . . . Lower layers of resistors . . . Layers between or around resistive elements
JD11 JD12 JD13 JD14 JD15 JD16 JD17 JD18
. . Partial layers . . Entire surface layers . Materials . Manufacturing methods * . Purposes . . Heat storage . . Heat discharge or heat transfer . Protection or barriers
B41J2/335,101@E JE JE00
ELECTRODE 		JE01 JE02 JE03 JE04 JE05 JE06 JE07 JE08 JE09 JE10
. Materials . . Gold . . Copper . . Aluminium . . Nickel . . Chromium . . Silver or platinum . . Others [materials] . Resistor materials [materials] . Structures
JE11 JE12 JE13 JE14 JE15 JE16 JE17 JE18 JE19
. . One-layer structures . . Two-layer structures . . Three or more layers . . Thin films . . Thick films . . Layers or elements with special functions * . . Conductor connections or multilayered wiring * . Manufacturing methods (manufacturing methods) . . Plating (F-term) "electroless"
B41J2/335,101@F JF JF00
WEAR-RESISTANT LAYER OR PROTECTIVE LAYER 		JF01 JF02 JF03 JF04 JF05 JF06 JF07 JF08 JF09 JF10
. Number of layers . . One layer . . Two layers . Purposes . . Prevention of wear . . Prevention of oxidation . . Protection . . Protection of electrodes . Materials . . Tantalum oxides
JF11 JF12 JF13 JF14 JF15 JF16 JF17 JF18 JF19 JF20
. . Silicon oxides . . Silicon nitrides . . Aluminium oxides . . Silicon carbide . . Tungsten nickel titanium or chromium . . Oxygen nitrogen carbon boron and phosphorus other than above . . Glass . . Plastics or resins . . Others (purposes) [materials] . Resistor materials (F-term) [materials]
JF21
. Manufacturing methods
B41J2/335,101@H JH JH00
MANUFACTURING METHOD 		JH01 JH02 JH03 JH04 JH05 JH06 JH07 JH08 JH09 JH10
. Target structures * . . Heating parts * . . Multilayered wiring parts * . . Target layers * . . . Substrates or glaze layers * . . . Resistive layers * . . . Conductive layers * . . . Protective layers or wear-resistant layers * . Manufacturing processes * . . Photoetching *
JH11 JH12 JH13 JH14 JH15 JH16 JH17 JH18 JH19
. . Vapour deposition or sputtering i.e. formation of thin films * . . Printing i.e. formation of thick films * . . Plating soldering or bonding * . . Heating heat treatment baking or oxidation * . . Cutting separation or grinding * . . Assembly * . . . Positioning * . . . Adhesion or welding * . . Resistance value adjustment *
B41J2/345@A KA KA00
PLANE SHAPE OF HEATER 		KA01 KA02 KA03 KA04 KA05 KA06 KA07 KA08 KA09 KA10
. Disposition or shapes * . . Meandering types . . Parallel disposition of a plurality of parts . . having openings . . Oblique shapes . . having different resistance values * . . . Thickness variations * . . . Variations based on shapes * . . related to scanning * . . Special structures of conductors *
KA11 KA12 KA13 KA14 KA15
. Purposes . . Uniformity of temperature distribution . . . Prevention of heat diffusion . . Resistance value adjustment . . Prevention of gaps between dots
B41J2/345@B KB KB00
SHAPE OR DISPOSITION OF CONDUCTOR 		KB01 KB02 KB03 KB04 KB05 KB06 KB07 KB08 KB09 KB10
. Structures * . . Thin films . . Thick films . . Disposition on flat surfaces * . . . Special individual electrode structures * . . . Special common electrode structures * . . Three-dimensional structures * . . Conductors for functional elements * . . Structures of connection parts * . . . Wire bonding *
KB11 KB12 KB13 KB14 KB15 KB16 KB17 KB18
. . . Flexible printed boards * . . . Connections of linear resistors and conductors * . Purposes . . Resistance value adjustment or equalisation . . Enhancement of high density . Manufacturing methods * . . Beam cutting . . Plating
B41J2/345@C KC KC00
MULTILAYERED WIRING 		KC01 KC02 KC03 KC04 KC05 KC06 KC07 KC08 KC09 KC10
. Structures of conductors * . . Three or more layers . . Thin films . . Thick films . . Matrix wiring . . Conductor substrates . . Wiring for integrated circuits . Insulating layers * . . Tapes or films . . Layered films
KC11
. Manufacturing methods *
B41J2/345@D KD KD00
CONTINUOUS RESISTOR 		KD01 KD02 KD03 KD04 KD05 KD06 KD07 KD08 KD09 KD10
. Disposition or structures of resistors * . . Two-line disposition . . Meandering shapes . . Disposition or structures of conductors * . . Unidirectionally crossing types . . Alternatively crossing types . . Front facing types . . Obliquely opposed types . . Three-dimensional disposition . . Structures of common electrodes *
KD11 KD12
. . Structures of connections * . Others (purposes) *
B41J2/345@J;2/345@Z KJ KJ00
ARRANGEMENT OF RESISTOR 		KJ01 KJ02 KJ03 KJ04 KJ05 KJ06 KJ07 KJ08 KJ09 KJ10
. Element shapes * . . Oblique shapes . Arrangements * . . Parallel arrangements . . Staggered arrangements . . Oblique arrangements . . . Variable angles . . . Block units . . Definitions for sizes gaps or disposition of elements * . . . having both large and small elements or gaps *
KJ11 KJ12 KJ13 KJ14 KJ15 KJ16 KJ17
. . Elements with special functions * . . . for ruled lines . . . for detection (objects to be detected) . Others (purposes) * . . Resistance value adjustment . . Connection structures of conductors * . . Driving energy control (purposes)
B41J2/345@K KK KK00
DISPOSITION OF DIODE OR DRIVING ELEMENT 		KK01 KK02 KK03 KK04 KK05 KK06 KK07 KK08 KK09 KK10
. Kinds of functional elements * . . Transistors . . . Integrated circuits (IC) . . Diodes . . . Diode arrays . Functional elements and structures or disposition of the devices * . . Chip disposition * . . . Staggered disposition . . . Disposition on lateral or back sides of substrates . . Height matching *
KK11 KK12 KK13 KK14 KK15 KK16 KK17 KK18 KK19 KK20
. . Integrally formed elements * . Wiring or connection objects * . . Multilayered wiring * . . . Matrix wiring or connections * . . Wiring or connections for functional elements * . . . Wiring or connections for integrated circuits * . . Connections between substrates * . . Connections between substrates and exterior cables * . Connection structures or methods * . . Wire bonding *
KK21 KK22 KK23 KK24 KK25 KK26
. . Wireless bonding * . . . Flexible substrates * . . Die bonds . Manufacturing methods * . Others (purposes) * . . Protection of functional elements *
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