Descriptions for H10W and notes/indexes are displayed on this screen.
| H10W
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GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10[2026.01]
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Note(s)
This subclass covers:[2026.01]packages of devices and parts of such packages;interconnections of devices in chips, wafers, substrates or packages;connectors of devices in packages;other constructional details of devices in chips, wafers, substrates or packages, e.g. isolation regions between components of integrated devices;detachable holders for supporting packaged chips in operation;the manufacture or treatment of aspects (a)-(e);when aspects (a)-(e) are(1) applicable to devices covered by subclass H10B;(2) applicable to devices covered by subclass H10D, except for semiconductor bodies or electrodes thereof, which are covered by subgroups H10D 62/00 or H10D 64/00; or(3) generically applicable to devices covered by subclasses H10B, H10D, H10F, H10H, H10K or H10N. In this subclass, the periodic system used is the I to VIII group system indicated in the Periodic Table under Note (3) of section C.
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Subclass indexes
CONSTRUCTIONAL DETAILS OF INTEGRATED DEVICES IN CHIPS, WAFERS OR SUBSTRATES | Isolation regions in semiconductor bodies between components of integrated devices | 10/00 | Highly-doped buried regions of integrated devices | 15/00 | Interconnections in chips, wafers or substrates | 20/00 | Generic parts of integrated devices, not otherwise provided for | 29/00 | CONSTRUCTIONAL DETAILS RELATED TO CHIPS, WAFERS, SUBSTRATES OR PACKAGES | Arrangements for thermal protection or control | 40/00 | Arrangements for protection of devices | 42/00 | Electrical arrangements for controlling or matching impedance | 44/00 | Marks applied to devices | 46/00 | ASPECTS OF PACKAGES | Package substrates; Interposers; Redistribution layers | 70/00 | Interconnections or connectors in packages | 72/00 | Encapsulations | 74/00 | Containers; Fillings; Seals | 76/00 | Detachable holders for supporting packaged chips in operation | 78/00 | Direct bonding of chips, wafers or substrates | 80/00 | Package configurations | 90/00 | Packaging processes not covered by the other groups of this subclass | 95/00 | Subject matter not provided for in other groups of this subclass | 99/00 |
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