Descriptions for H10P and notes/indexes are displayed on this screen.
| H10P
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GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10[2026.01]
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Note(s)
This subclass covers processes or apparatus specially adapted for the manufacture or treatment of devices, or parts thereof, covered by class H10, which are generically applicable to these devices.[2026.01]Attention is drawn to the following:processes or apparatus specially adapted for the manufacture or treatment of devices, or parts thereof, which are covered by a single subclass of H10B-H10N, are classified in the subclass in question. For example, the manufacture of a transistor is classified in subclass H10D;processes or apparatus specially adapted for the manufacture or treatment of generic packages, interconnections, connectors or other constructional details of devices, which are covered by subclass H10W, are classified in the subclass in question. For example, the formation of a copper pillar bump connector is classified in subclass H10W. In this subclass, the periodic system used is the I to VIII group system indicated in the Periodic Table under Note (3) of section C.
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Subclass indexes
BUILDING UP OF LAYERS, STRUCTURES OR MATERIALS | Bonding | 10/00 | Formation of materials | 14/00 | MODIFICATION OF LAYERS, STRUCTURES OR MATERIALS | Ion implantation | 30/00 | Diffusion of dopants | 32/00 | Irradiation with electromagnetic or particle radiation | 34/00 | Gettering | 36/00 | REMOVAL OF LAYERS, STRUCTURES OR MATERIALS | Etching | 50/00 | Grinding, lapping or polishing | 52/00 | Cutting or separating | 54/00 | Debonding | 56/00 | Singulating wafers or substrates into multiple chips, i.e. dicing | 58/00 | OTHER MANUFACTURE OR TREATMENT | Cleaning | 70/00 | Handling or holding of wafers, substrates or devices during manufacture or treatment thereof | 72/00 | Testing or measuring during manufacture or treatment of wafers, substrates or devices | 74/00 | Manufacture or treatment of masks on semiconductor bodies | 76/00 | Preparation of wafers | 90/00 | Other generic processes or apparatus for manufacture or treatments | 95/00 |
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