B23K26/00

Working by laser beam, e.g. welding, cutting or boring

Note(s) This main group covers :[2014 01] laser working for making a weakened layer, with or without removing material;laser shock processing;apparatus for laser surface treatment;laser ablation  This main group does not cover : laser assisted deposition which is covered by subclass C23C;laser sintering which is covered by group B22F 3/105 for metallic powder, by group B29C 67/04 for plastics, by group C03B 19/06 for glass or by group C04B 35/64 for ceramics;laser assisted chemical etching which is covered by group C23F 1/00