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  • H01H11/00
    		•  Apparatus or processes specially adapted for the manufacture of electric switches (processes or apparatus specially adapted for the manufacture or treatment of micro-structural devices or systems, e.g. in combination with electrical devices, B81C) HB CC 5G023
  • H01H11/00@A
    		•  Manufacture of electric switches HB CC 5G023
  • H01H11/00@B
    		•  .Manufacture of pushbutton switches HB CC 5G023
  • H01H11/00@C
    		•  ..Manufacture of diaphragm switches HB CC 5G023
  • H01H11/00@D
    		•  ..manufacture of dome spring type switches HB CC 5G023
  • H01H11/00@E
    		•  ..Manufacture of key tops HB CC 5G023
  • H01H11/00@F
    		•  ..Manufacture of pressurised conductive rubber type switches HB CC 5G023
  • H01H11/00@G
    		•  ..Manufacture of non-contact type switches HB CC 5G023
  • H01H11/00@H
    		•  .Means for adhering contacts, probes or terminals to insulating members HB CC 5G023
  • H01H11/00@J
    		•  .Manufacture of slide switches HB CC 5G023
  • H01H11/00@K
    		•  .Manufacture of pull switches HB CC 5G023
  • H01H11/00@L
    		•  .Manufacture of rotary switches HB CC 5G023
  • H01H11/00@M
    		•  .Manufacture of lever switches HB CC 5G023
  • H01H11/00@N
    		•  .Manufacture of tumbler switches HB CC 5G023
  • H01H11/00@P
    		•  .Manufacture of combination switches HB CC 5G023
  • H01H11/00@Q
    		•  .Manufacture of proximity switches HB CC 5G023
  • H01H11/00@R
    		•  .Manufacture of reed switches HB CC 5G023
  • H01H11/00@S
    		•  ..Means for setting contact piece gaps HB CC 5G023
  • H01H11/00@T
    		•  .Manufacture of wet reed switches HB CC 5G023
  • H01H11/00@U
    		•  .Manufacture of heat actuated switches HB CC 5G023
  • H01H11/00@V
    		•  .manufacture of relays HB CC 5G023
  • H01H11/00@Z
    		•  Others HB CC 5G023
  • H01H11/02
    		•  .for mercury switches HB CC 5G023
  • H01H11/04
    		•  .of switch contacts HB CC 5G023
  • H01H11/04@A
    		•  Related to contacts HB CC 5G023
  • H01H11/04@B
    		•  .Manufacture of contacts HB CC 5G023
  • H01H11/04@C
    		•  ..Press processing methods HB CC 5G023
  • H01H11/04@D
    		•  ..Sintering methods HB CC 5G023
  • H01H11/04@E
    		•  ..Internal oxidising methods HB CC 5G023
  • H01H11/04@F
    		•  .Surface treatment methods HB CC 5G023
  • H01H11/04@G
    		•  .Manufacture of printed wiring board type contacts HB CC 5G023
  • H01H11/04@R
    		•  .Manufacturing reed pieces HB CC 5G023
  • H01H11/04@Z
    		•  Others HB CC 5G023
  • H01H11/06
    		•  ..Fixing of contacts to carrier HB CC 5G023
  • H01H11/06@A
    		•  Means for adhering contacts HB CC 5G023
  • H01H11/06@B
    		•  .Mechanical adhering HB CC 5G023
  • H01H11/06@C
    		•  .Resistance welding HB CC 5G023
  • H01H11/06@D
    		•  ..Projection welding HB CC 5G023
  • H01H11/06@E
    		•  ..Seam welding HB CC 5G023
  • H01H11/06@F
    		•  .Brazing or soldering HB CC 5G023
  • H01H11/06@G
    		•  .Laser or electron beam welding HB CC 5G023
  • H01H11/06@H
    		•  .Ultrasonic welding HB CC 5G023
  • H01H11/06@Z
    		•  Others HB CC 5G023
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