FI (list display)

  • H01C17/00
  • Apparatus or processes specially adapted for manufacturing resistors (providing fillings for housings or enclosures H01C 1/02; reducing insulation surrounding a resistor to powder H01C 1/03; manufacture of thermally variable resistors H01C 7/02, H01C 7/04) [2] HB CC 5E032
  • H01C17/00,100
  • .For manufacturing chip type resistors HB CC 5E032
  • H01C17/00,200
  • .Correcting, folding, bending or trimming lead wires HB CC 5E032
  • H01C17/00,300
  • .For manufacturing fixed resistors HB CC 5E032
  • H01C17/02
  • .adapted for manufacturing resistors with outer cover or container (apparatus or method for filling or compressing insulating material in heating element tubes H05B 3/52) [2] HB CC 5E032
  • H01C17/04
  • .adapted for winding the resistive element [2] HB CC 5E032
  • H01C17/06
  • .adapted for coating resistive material on a base [2] HB CC 5E032
  • H01C17/065
  • ..by thick-film techniques, e.g. serigraphy [6] HB CC 5E032
  • H01C17/065,100
  • ...Resistance subjects prepared by printing or applying HB CC 5E032
  • H01C17/065,110
  • ....Characterised by preparations of electrodes or patterns HB CC 5E032
  • H01C17/065,120
  • ....Carbon composition films (carbon resins) HB CC 5E032
  • H01C17/065,130
  • ....Glazed films HB CC 5E032
  • H01C17/065,200
  • ...Transferring HB CC 5E032
  • H01C17/065,300
  • ...making metallic film, e.g. nitride or oxide HB CC 5E032
  • H01C17/065,310
  • ....characterized by making of electrode or pattern HB CC 5E032
  • H01C17/065,320
  • ....Cermets (SiO-Metal) HB CC 5E032
  • H01C17/065,400
  • ...Preparing resistance films by irradiating laser beam; heating and carbonising by means other than by lasers HB CC 5E032
  • H01C17/065,500
  • ...Characterised by preparations of electrodes or patterns (H01C17/065, 110, H01C17/065, 310 takes precedence.) HB CC 5E032
  • H01C17/065,600
  • ...Characterised by bases HB CC 5E032
  • H01C17/065,700
  • ...Preparing by cutting base into small fragments HB CC 5E032
  • H01C17/065,800
  • ...Smoothening resistor or electrode surfaces (H01C17/065, 200 takes precedence.) HB CC 5E032
  • H01C17/07
  • ..by resistor foil bonding, e.g. cladding [6] HB CC 5E032
  • H01C17/075
  • ..by thin-film techniques [6] HB CC 5E032
  • H01C17/08
  • ...by vapour deposition [2] HB CC 5E032
  • H01C17/10
  • ...by flame spraying [2] HB CC 5E032
  • H01C17/12
  • ...by sputtering [2] HB CC 5E032
  • H01C17/14
  • ...by chemical deposition [2] HB CC 5E032
  • H01C17/16
  • ....using electric current [2] HB CC 5E032
  • H01C17/18
  • ....without using electric current [2] HB CC 5E032
  • H01C17/20
  • ..by pyrolytic processes [2] HB CC 5E032
  • H01C17/22
  • .adapted for trimming [2] HB CC 5E032
  • H01C17/23
  • ..by opening or closing resistor tracks of predetermined resistive values [6] HB CC 5E032
  • H01C17/232
  • ..Adjusting the temperature coefficient; Adjusting value of resistance by adjusting temperature coefficient [6] HB CC 5E032
  • H01C17/235
  • ..Initial adjustment of potentiometer parts for calibration [6] HB CC 5E032
  • H01C17/24
  • ..by removing or adding resistive material (H01C17/23, H01C17/232, H01C17/235 take precedence) [2,6] HB CC 5E032
  • H01C17/242
  • ...by laser [6] HB CC 5E032
  • H01C17/245
  • ...by mechanical means, e.g. sand-blasting, cutting, ultrasonic treatment [6] HB CC 5E032
  • H01C17/26
  • ..by converting resistive material [2] HB CC 5E032
  • H01C17/28
  • .adapted for applying terminals [2] HB CC 5E032
  • H01C17/30
  • .adapted for baking [2] HB CC 5E032
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