FI (list display)

  • C30B29/00
  • Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape HB CC 4G077
  • C30B29/02
  • .Elements [3] HB CC 4G077
  • C30B29/04
  • ..Diamond [3] HB CC 4G077
  • C30B29/04@A
  • Making diamond film by gas state method (particle coating R T) HB CC 4G077
  • C30B29/04@B
  • .Generating plasma (other than C to F, or with no specified means of generation) HB CC 4G077
  • C30B29/04@C
  • ..By DC discharge plasma HB CC 4G077
  • C30B29/04@D
  • ..By high frequency plasma HB CC 4G077
  • C30B29/04@E
  • ..By microwave plasma HB CC 4G077
  • C30B29/04@F
  • ..By cyclotron resonance plasma HB CC 4G077
  • C30B29/04@G
  • .Activating material gas by heating body, e.g. heat filament, heating substrate (including atmospheric heating) HB CC 4G077
  • C30B29/04@H
  • .Activating material gas by combustion flame HB CC 4G077
  • C30B29/04@J
  • .Activating material gas by thermal electronic irradiation HB CC 4G077
  • C30B29/04@K
  • .Activating material gas by light irradiation HB CC 4G077
  • C30B29/04@L
  • .Activating material gas by ion beam irradiation HB CC 4G077
  • C30B29/04@M
  • .By vacuum evaporation, sputtering HB CC 4G077
  • C30B29/04@N
  • .With no specified diaphragm forming means as in B to M HB CC 4G077
  • C30B29/04@P
  • ..Characterized by substrate materials HB CC 4G077
  • C30B29/04@Q
  • ..Characterized by treatment of substrate, e.g. surface treatment, formation of intermediate layer) HB CC 4G077
  • C30B29/04@R
  • ..Characterized by composition of material gas HB CC 4G077
  • C30B29/04@S
  • Manufacture of diamond in shapes, e.g. particles, other than film using gas state method HB CC 4G077
  • C30B29/04@T
  • Coating other material particles for diamonds using gas state method HB CC 4G077
  • C30B29/04@U
  • Manufacture of diamond not using gas state method HB CC 4G077
  • C30B29/04@V
  • Treatment of diamond crystals HB CC 4G077
  • C30B29/04@W
  • Articles comprised of or containing diamonds HB CC 4G077
  • C30B29/04@X
  • .Articles with gas state method diamond coating on substrate surface HB CC 4G077
  • C30B29/04@Z
  • Others HB CC 4G077
  • C30B29/06
  • ..Silicon [3] HB CC 4G077
  • C30B29/06@A
  • Characterized by crystal per se, e.g. concentration of impurities, physical properties, determination of crystal direction HB CC 4G077
  • C30B29/06@B
  • After-treatment of crystals HB CC 4G077
  • C30B29/06@C
  • Articles using Si crystals HB CC 4G077
  • C30B29/06@D
  • Manufacture of Si materials for crystal growth, e.g. manufacture of high-purity polycrystalline silicon rod HB CC 4G077
  • C30B29/06@Z
  • Others HB CC 4G077
  • C30B29/06,501
  • ...Growth from liquid phase HB CC 4G077
  • C30B29/06,501@A
  • Growth by zone melting HB CC 4G077
  • C30B29/06,501@B
  • Liquid phase epitaxitial growth HB CC 4G077
  • C30B29/06,501@Z
  • Others HB CC 4G077
  • C30B29/06,502
  • ....By pull-up method HB CC 4G077
  • C30B29/06,502@A
  • Supply of material powder, formation of a melt HB CC 4G077
  • C30B29/06,502@B
  • Melting pots (including jigs used by being part of, or being sticking together with melting pot) HB CC 4G077
  • C30B29/06,502@C
  • Jigs used inside pull-up furnaces, e.g. heat shield plates, heat-retention tubes etc. (E takes precedence) HB CC 4G077
  • C30B29/06,502@D
  • .Placed inside a melt (E takes precedence) HB CC 4G077
  • C30B29/06,502@E
  • Characterized by heating, cooling means HB CC 4G077
  • C30B29/06,502@F
  • Characterized by the seed and see crystal retention, pull-up devices HB CC 4G077
  • C30B29/06,502@G
  • Using magnetic field HB CC 4G077
  • C30B29/06,502@H
  • Controlling the volume of impurities, inevitable impurities HB CC 4G077
  • C30B29/06,502@J
  • Control of pull-up speed, rotating speed (H takes precedence) HB CC 4G077
  • C30B29/06,502@K
  • Adjustment of atmosphere inside pull-up furnace (supply, discharge, pressure adjustment of atmospheric gas) HB CC 4G077
  • C30B29/06,502@Z
  • Others HB CC 4G077
  • C30B29/06,503
  • ...Pulling up plate, strip silicon from a melt HB CC 4G077
  • C30B29/06,504
  • ...Growth from gas state HB CC 4G077
  • C30B29/06,504@A
  • Growth to film on substrate HB CC 4G077
  • C30B29/06,504@B
  • .Characterized by selection of material gas, composition HB CC 4G077
  • C30B29/06,504@C
  • .Characterized by supply/discharge, flow of material gas, HB CC 4G077
  • C30B29/06,504@D
  • .Characterized by heating, cooling means, methods of substrate HB CC 4G077
  • C30B29/06,504@E
  • .Characterized by selection of substrate materials (F takes precedence) HB CC 4G077
  • C30B29/06,504@F
  • .Treatment of substrates (J takes precedence); Forming film of Si and above on substrate that later grows into Si film, e.g. formation of buffer film HB CC 4G077
  • C30B29/06,504@G
  • .Growing Si film in two or more processes HB CC 4G077
  • C30B29/06,504@H
  • .Growing Si film on time constant area of substrate (J takes precedence) HB CC 4G077
  • C30B29/06,504@J
  • .Growing on seed crystal of substrate HB CC 4G077
  • C30B29/06,504@K
  • .Applying treatment on Si film formed on substrate, e.g. single crystallisation of noncrystalline Si film, doping HB CC 4G077
  • C30B29/06,504@L
  • .Characterized by devices, jigs for gas state growth, e.g. substrate support, bell jar, C to K Take precedence HB CC 4G077
  • C30B29/06,504@Z
  • Others HB CC 4G077
  • C30B29/08
  • ..Germanium [3] HB CC 4G077
  • C30B29/10
  • .Inorganic compounds or compositions [3] HB CC 4G077
  • C30B29/12
  • ..Halides [3] HB CC 4G077
  • C30B29/14
  • ..Phosphates [3] HB CC 4G077
  • C30B29/16
  • ..Oxides [3] HB CC 4G077
  • C30B29/18
  • ...Quartz [3] HB CC 4G077
  • C30B29/20
  • ...Aluminium oxides [3] HB CC 4G077
  • C30B29/22
  • ...Complex oxides [3] HB CC 4G077
  • C30B29/22@A
  • Containing Al (Apply right place rule for A to F) HB CC 4G077
  • C30B29/22@B
  • .BeAl2O4 (chrysoberyl, alexandrite) HB CC 4G077
  • C30B29/22@C
  • Containing HB CC 4G077
  • C30B29/22@D
  • Containing HB CC 4G077
  • C30B29/22@F
  • Ferrite HB CC 4G077
  • C30B29/22@G
  • .Containing Mn and Zn HB CC 4G077
  • C30B29/22@Z
  • Others HB CC 4G077
  • C30B29/22,501
  • ....Superconducting materials HB CC 4G077
  • C30B29/22,501@A
  • Growth from solid state HB CC 4G077
  • C30B29/22,501@B
  • Growth from liquid state HB CC 4G077
  • C30B29/22,501@C
  • .Forming superconducting layer on substrate HB CC 4G077
  • C30B29/22,501@D
  • Growth by gas state method HB CC 4G077
  • C30B29/22,501@E
  • .Forming superconducting layer on substrate HB CC 4G077
  • C30B29/22,501@H
  • ..By sputtering (J to N take precedence) HB CC 4G077
  • C30B29/22,501@J
  • ..Characterized by selection of substrate HB CC 4G077
  • C30B29/22,501@K
  • ..Treatment of substrates, forming intermediate layer between substrate and superconducting layer HB CC 4G077
  • C30B29/22,501@L
  • ..Applying treatment on superconducting layer after making of film, e.g. heat treatment, ion injection treatment etc. HB CC 4G077
  • C30B29/22,501@M
  • ..Forming superconducting layer on multiple layers or forming layer of other materials on the surface of superconducting layer HB CC 4G077
  • C30B29/22,501@N
  • Characterized by the purpose of articles using superconducting materials, e.g. semiconductor devices, semiconductor substrates, wires HB CC 4G077
  • C30B29/22,501@P
  • Characterized by after-treatment of superconducting crystals (L takes precedence) HB CC 4G077
  • C30B29/22,501@Z
  • Others HB CC 4G077
  • C30B29/24
  • ....with formula AMeO3, wherein A is a rare earth metal and Me is Fe, Ga, Sc, Cr, Co, or Al, e.g. ortho ferrites [3] HB CC 4G077
  • C30B29/26
  • ....with formula BMe2O4, wherein B is Mg, Ni, Co, Al, Zn or Cd and Me is Fe, Ga, Sc, Cr, Co, or Al [3] HB CC 4G077
  • C30B29/28
  • ....with formula A3Me5O12, wherein A is a rare earth metal and Me is Fe, Ga, Sc, Cr, Co or Al, e.g. garnets [3] HB CC 4G077
  • C30B29/30
  • ....Niobates; Vanadates; Tantalates [3] HB CC 4G077
  • C30B29/30@A
  • Niobates (C takes precedence) HB CC 4G077
  • C30B29/30@B
  • Tantalates (C takes precedence) HB CC 4G077
  • C30B29/30@C
  • Containing niobates and tantalates HB CC 4G077
  • C30B29/30@D
  • Vanadates HB CC 4G077
  • C30B29/30@Z
  • Others HB CC 4G077
  • C30B29/32
  • ....Titanates; Germanates; Molybdates; Tungstates [3] HB CC 4G077
  • C30B29/32@A
  • Titanates HB CC 4G077
  • C30B29/32@B
  • .Titanates of alkaline metal HB CC 4G077
  • C30B29/32@C
  • .Titanates of alkaline earth metal HB CC 4G077
  • C30B29/32@D
  • .Lead titanates HB CC 4G077
  • C30B29/32@G
  • Germanates HB CC 4G077
  • C30B29/32@M
  • Molybdates HB CC 4G077
  • C30B29/32@W
  • Tungstates HB CC 4G077
  • C30B29/32@Z
  • Others HB CC 4G077
  • C30B29/34
  • ..Silicates [3] HB CC 4G077
  • C30B29/34@A
  • Beryls (BeO-Al2O3-SiO2) HB CC 4G077
  • C30B29/34@Z
  • Others HB CC 4G077
  • C30B29/36
  • ..Carbides [3] HB CC 4G077
  • C30B29/36@A
  • Carbides HB CC 4G077
  • C30B29/36@Z
  • Others HB CC 4G077
  • C30B29/38
  • ..Nitrides [3] HB CC 4G077
  • C30B29/38@A
  • Containing B, e.g. BN, BCN HB CC 4G077
  • C30B29/38@B
  • Containing Si, e.g. Si3N4 HB CC 4G077
  • C30B29/38@C
  • Containing Al, e.g. AIN HB CC 4G077
  • C30B29/38@D
  • Containing Ga, e.g. GaN HB CC 4G077
  • C30B29/38@Z
  • Others HB CC 4G077
  • C30B29/40
  • ..AIIIBV compounds [3] HB CC 4G077
  • C30B29/40@A
  • Characterized by crystal per se, e.g. determination of physical properties and concentration of impurities in crystal HB CC 4G077
  • C30B29/40@B
  • Synthesis, refining of materials for crystal growth HB CC 4G077
  • C30B29/40@C
  • Treatment of crystals HB CC 4G077
  • C30B29/40@D
  • Purpose of articles using A3BV compound crystal HB CC 4G077
  • C30B29/40@Z
  • Others HB CC 4G077
  • C30B29/40,501
  • ...Growth from liquid state HB CC 4G077
  • C30B29/40,501@A
  • By pull-up method HB CC 4G077
  • C30B29/40,501@B
  • Growing film on substrate from liquid state HB CC 4G077
  • C30B29/40,501@C
  • By normal freezing or temperature gradient coagulation HB CC 4G077
  • C30B29/40,501@D
  • By band melting method HB CC 4G077
  • C30B29/40,501@E
  • By solute synthesis diffusion method HB CC 4G077
  • C30B29/40,501@Z
  • Others HB CC 4G077
  • C30B29/40,502
  • ...Growth from gas state HB CC 4G077
  • C30B29/40,502@A
  • Growth of film on substrate (by molecular beam K) HB CC 4G077
  • C30B29/40,502@B
  • .Characterized by selection of material gas HB CC 4G077
  • C30B29/40,502@C
  • ..Characterized by selection of ingredient gas other than 3, V group, e.g. impurity gas, carrier gas HB CC 4G077
  • C30B29/40,502@D
  • .Generation, supply, discharge of material gas HB CC 4G077
  • C30B29/40,502@E
  • ..Changing supply volume, mix of material gas during growth, e.g. alternately supplying ingredients, changing supply volume of certain ingredient HB CC 4G077
  • C30B29/40,502@F
  • .Characterized by substrate materials HB CC 4G077
  • C30B29/40,502@G
  • .Treatment of substrates (Forming other film of Si on substrate that later growing it, H) HB CC 4G077
  • C30B29/40,502@H
  • .Forming other layer between substrate and growth layer, e.g. buffer layer, or forming multiple growth layers on substrate HB CC 4G077
  • C30B29/40,502@J
  • .Growing on certain areas of substrate HB CC 4G077
  • C30B29/40,502@K
  • .Growing by molecular beam HB CC 4G077
  • C30B29/40,502@L
  • Obtaining crystal of shapes other than film from the gas method HB CC 4G077
  • C30B29/40,502@Z
  • Others HB CC 4G077
  • C30B29/42
  • ...Gallium arsenide [3] HB CC 4G077
  • C30B29/44
  • ...Gallium phosphide [3] HB CC 4G077
  • C30B29/46
  • ..Sulfur-, selenium- or tellurium-containing compounds [3] HB CC 4G077
  • C30B29/48
  • ...AIIBVI compounds [3] HB CC 4G077
  • C30B29/50
  • ....Cadmium sulfide [3] HB CC 4G077
  • C30B29/52
  • ..Alloys [3] HB CC 4G077
  • C30B29/54
  • .Organic compounds [3] HB CC 4G077
  • C30B29/56
  • ..Tartrates [3] HB CC 4G077
  • C30B29/58
  • ..Macromolecular compounds [3] HB CC 4G077
  • C30B29/60
  • .characterised by shape [3] HB CC 4G077
  • C30B29/62
  • ..Whiskers or needles [3] HB CC 4G077
  • C30B29/62@A
  • Oxides (composite oxides, E) HB CC 4G077
  • C30B29/62@B
  • .Alumina HB CC 4G077
  • C30B29/62@C
  • .Titanium oxides HB CC 4G077
  • C30B29/62@D
  • .Zinc oxides HB CC 4G077
  • C30B29/62@E
  • Composite oxides; oxysalt HB CC 4G077
  • C30B29/62@F
  • .Titanates HB CC 4G077
  • C30B29/62@G
  • .Hydrosulphates, e.g. calcium sulphates HB CC 4G077
  • C30B29/62@H
  • .Borates HB CC 4G077
  • C30B29/62@J
  • Carbides HB CC 4G077
  • C30B29/62@K
  • .Silicon carbide HB CC 4G077
  • C30B29/62@L
  • ..Using silicon dioxide as material HB CC 4G077
  • C30B29/62@M
  • ..Using Si, Si alloy as material HB CC 4G077
  • C30B29/62@N
  • ..Using degradable silicon compounds, e.g. organic silicon compounds, or gaseous silicon compounds as material HB CC 4G077
  • C30B29/62@P
  • ..Refining or treatment of silicon carbide whisker HB CC 4G077
  • C30B29/62@Q
  • Nitrides HB CC 4G077
  • C30B29/62@R
  • .Silicon nitride HB CC 4G077
  • C30B29/62@S
  • Carbon HB CC 4G077
  • C30B29/62@U
  • Metals, alloys HB CC 4G077
  • C30B29/62@V
  • Manufacturing method in general (with manufactured whiskers not specified) HB CC 4G077
  • C30B29/62@W
  • Treatment of whisker (with whisker not specified) HB CC 4G077
  • C30B29/62@Z
  • Others HB CC 4G077
  • C30B29/64
  • ..Flat crystals, e.g. plates, strips or disks [5] HB CC 4G077
  • C30B29/66
  • ..Crystals of complex geometrical shape, e.g. tubes, cylinders [5] HB CC 4G077
  • C30B29/68
  • ..Crystals with laminate structure, e.g. "superlattices" [5] HB CC 4G077
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