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FI (list display)

  • C25D15/00
    		•  Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires [2] HB CC 4K025
  • C25D15/00@A
    		•  By electrolysis HB CC 4K025
  • C25D15/00@B
    		•  By electrophoresis HB CC 4K025
  • C25D15/00@C
    		•  .Embedding materials HB CC 4K025
  • C25D15/00@D
    		•  ..Inorganic materials HB CC 4K025
  • C25D15/00@E
    		•  ..Organic materials HB CC 4K025
  • C25D15/00@Z
    		•  Others HB CC 4K025
  • C25D15/02
    		•  .Combined electrolytic and electrophoretic processes [2] HB CC 4K025
  • C25D15/02@A
    		•  Methods in general HB CC 4K025
  • C25D15/02@B
    		•  .Devices HB CC 4K025
  • C25D15/02@C
    		•  Plating by temporarily fixing the embedding material HB CC 4K025
  • C25D15/02@D
    		•  Embedding materials HB CC 4K025
  • C25D15/02@E
    		•  .Metals, alloys HB CC 4K025
  • C25D15/02@F
    		•  .Inorganic compounds, inorganic elements HB CC 4K025
  • C25D15/02@G
    		•  ..Oxides HB CC 4K025
  • C25D15/02@H
    		•  .Organic compounds HB CC 4K025
  • C25D15/02@J
    		•  .Lubricating, wear-resistant materials, e.g. applied t moving parts HB CC 4K025
  • C25D15/02@K
    		•  .Magnetic materials HB CC 4K025
  • C25D15/02@L
    		•  Additives; treatment of embedding materials HB CC 4K025
  • C25D15/02@M
    		•  Pre-treatment HB CC 4K025
  • C25D15/02@N
    		•  After-treatment HB CC 4K025
  • C25D15/02@P
    		•  Bath control; regeneration of treatment liquid HB CC 4K025
  • C25D15/02@Q
    		•  Multilayer coating HB CC 4K025
  • C25D15/02@Z
    		•  Others HB CC 4K025
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