This page displays all 「FI」 in main group B64U20/00. |
HB:Handbook | ||||
CC:Concordance |
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Constructional aspects of UAVs (of lift-producing means B64U 30/00) [2023.01] | HB | CC | 3D140 | |
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. for stealth, e.g. reduction of cross-section detectable by radars [2023.01] | HB | CC | 3D140 | |
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. for noise reduction [2023.01] | HB | CC | 3D140 | |
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. for safety, e.g. with frangible components (rotor guards B64U 30/299) [2023.01] | HB | CC | 3D140 | |
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. Modular UAVs [2023.01] | HB | CC | 3D140 | |
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. Foldable or collapsible UAVs (with frangible components B64U 20/30) [2023.01] | HB | CC | 3D140 | |
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. UAVs characterised by the material [2023.01] | HB | CC | 3D140 | |
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.. Composite materials [2023.01] | HB | CC | 3D140 | |
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. Constructional aspects of the UAV body [2023.01] | HB | CC | 3D140 | |
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.. Monocoque body [2023.01] | HB | CC | 3D140 | |
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.. the body formed by joined shells or by a shell overlaying a chassis [2023.01] | HB | CC | 3D140 | |
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.. the body being formed integrally with wings or rotor supports [2023.01] | HB | CC | 3D140 | |
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. Arrangement of on-board electronics, e.g. avionics systems or wiring [2023.01] | HB | CC | 3D140 | |
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.. Electronic components structurally integrated with aircraft elements, e.g. circuit boards carrying loads [2023.01] | HB | CC | 3D140 | |
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.. Mounting of imaging devices, e.g. mounting of gimbals [2023.01] | HB | CC | 3D140 | |
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. Cooling [2023.01] | HB | CC | 3D140 | |
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.. of avionics [2023.01] | HB | CC | 3D140 | |
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.. of rotors or rotor motors [2023.01] | HB | CC | 3D140 | |
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.. using air [2023.01] | HB | CC | 3D140 | |
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.. using liquid, e.g. using lubrication oil [2023.01] | HB | CC | 3D140 | |